Microlayer Polymeric Composites

本研究旨在研究微层(50-1000层)聚合物复合材料的加工--固态结构--性能关系。陶氏共挤技术将用于生产微层系统。固态结构和性能大相径庭的聚合物将被组合成微层结构，从而产生具有每一组分所需特征的复合系统。在某些情况下，通过后处理过程中的单轴和双轴取向将实现进一步的性能增强。这些复合系统的复杂行为将按照结构的层级进行分析。将阐明来自这些交互层级的属性的依赖关系和演化。特别是，将分析层厚度和层间附着力的影响。选择用于本研究的聚合物材料时，应注意微层工艺可实现的独特优势。具有耦合特性的坚韧结构将被研究，例如选定的光传输或屏蔽、差分势垒和传输特性或压电响应。通过使用高度不同聚合物的微层处理与固态结构和性能分析的分层方法相结合，将研究一类新的聚合物复合系统。

This research aims to study processing--solid state structure-- property relationships in microlayer (50 to 1000 layers) polymeric composites. Dow coextrusion technology will be used for the production of microlayer systems. Polymers of widely dissimilar solid-state structures and properties will be combined into microlayer structures, thereby producing a composite system with the desirable features of each component. In some instances, further property enhancement will be achieved by uniaxial and biaxial orientation in a post-processing procedure. The complex behavior of these composite systems will be analyzed in terms of heirarchical levels of structure. The dependency and evolution of properties from these interactive hierarchical levels will be elucidated. In particular, the effects of layer thickness and adhesion between layers will be analyzed. Polymeric materials selected for this study are chosen with attention to unique advantages that are achievable with the microlayer process. Tough structures with coupled properties, such as selected light transmission or shielding, differential barrier and transport properties or piezoelectric response, will be investigated. By using microlayer processing of highly dissimilar polymers in combination with the hierarchical approach to solid-state structure and property analysis, a new class of polymeric composite systems will be examined.