Automated Electronic Circuit Manfacturing Using Ink Jet Technology

将评估使用喷墨技术生产电子电路板、柔性电路和集成电路封装的可行性。如果成功，这种方法可以与计算机辅助设计系统接口，以产生快速的原型周转。封装是目前大多数定制电路开发中的重要项目之一。将评估四种特定电路工艺的应用：集成胶带自动粘合、传统集成封装、柔性电路和印刷电路板。将使用各种材料(包括导电材料和掩膜材料)和衬底来研究生产上述材料的可行性。如果项目成功，将提交第二阶段提案。

The feasibility of producing electronic circuit boards, flexible circuits, and integrated circuit packages using ink jet technology will be evaluated. If successful, this method could be interfaced with computer aided design systems to produce rapid turnaround of prototypes. Packaging is currently one of the pacing items in most custom circuit development. Application to four specific circuit processes will be evaluated: integrated tape automated bonding, conventional integrated packaging, flex circuits, and printed boards. The feasibility of producing the above will be examined using a variety of materials (both conductive and masking) and substrates. If the project is successful, a Phase II proposal will be submitted.