Multi-layer electronic circuit construct and method of making same

多层电子电路构造及其制造方法

• 批准号: 485209-2015
• 负责人: Chowdhury, Sazzadur
• 金额: $ 1.09万
• 依托单位: University of Windsor
• 依托单位国家: 加拿大
• 项目类别: Idea to Innovation
• 财政年份: 2015
• 资助国家: 加拿大
• 起止时间: 2015-01-01 至 2016-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=584796
• 关键词: Multi; layer; electronic; circuit; construct

This technology solves issues related to long conductor track length and long routing of interconnections by vertically aligning embedded circuit components in layers of Benzocyclobutene (BCB). We propose that our technology improves what is currently in use because it will increase signal propagation, limits noise and decrease motherboard space. Current 'optimal' methods of decreasing space involve the creation of separate circuits that are stacked together and subsequently connected. Our technology eliminates the creation of separate circuits and hassle of connecting them together. Instead, we have created a system in which 3D circuits are embedded in the BCB itself which is mounted on a single silicon substrate can accommodate without restriction resistors, transistors, memory, capacitors, as well as other inductors, semiconductors, chips and the like. This technology will enable circuits to operate more efficiently as a result of shorter travel distance.

该技术通过在苯并环丁烯（BCB）层中垂直对准嵌入式电路组件来解决与长导体轨道长度和长互连布线相关的问题。 我们建议我们的技术改进目前使用的技术，因为它将增加信号传播，限制噪声并减少主板空间。 目前减少空间的“最佳”方法涉及创建堆叠在一起并随后连接的单独电路。 我们的技术消除了创建单独的电路和连接它们在一起的麻烦。 相反，我们已经创建了一个系统，其中3D电路嵌入在BCB本身中，BCB安装在单个硅衬底上，可以无限制地容纳电阻器、晶体管、存储器、电容器以及其他电感器、半导体、芯片等。 这项技术将使电路能够更有效地工作，因为行程更短。