Multi-layer electronic circuit construct and method of making same

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This technology solves issues related to long conductor track length and long routing of interconnections by vertically aligning embedded circuit components in layers of Benzocyclobutene (BCB). We propose that our technology improves what is currently in use because it will increase signal propagation, limits noise and decrease motherboard space. Current 'optimal' methods of decreasing space involve the creation of separate circuits that are stacked together and subsequently connected. Our technology eliminates the creation of separate circuits and hassle of connecting them together. Instead, we have created a system in which 3D circuits are embedded in the BCB itself which is mounted on a single silicon substrate can accommodate without restriction resistors, transistors, memory, capacitors, as well as other inductors, semiconductors, chips and the like. This technology will enable circuits to operate more efficiently as a result of shorter travel distance.