Expedited Award for Novel Research: Fabrication of Micro Electro Mechanical Actuators and Motors

微机械器件在硅芯片上的集成是一种 新兴技术 微机械装置，包括致动器， 电机和传感器，预计将在机器人技术中得到应用， 仪器、医疗探测器、天基系统和传感器 阵 最近的研究结果表明，运动部件，如 齿轮、连杆和马达，都可以用改性硅制造 加工技术 拟议的研究旨在开发一种CVD 硅上钨技术制造完全释放，可移动 用于致动器和马达的微结构。 具体而言， 研究内容包括：（1）开发钨硅工艺， 产生无应力的、可移动的微结构，（2）制造 线性，静电致动器与10微米的行程，使用 钨硅技术，（3）制造测试结构， 钨硅合金摩擦应力的测量与表征 微结构系统，（4）制造线性微电机，以及（5） 确定未来研究的关键科学和技术问题 微机电系统的发展。

The integration of micromechanical devices on silicon chips is an emerging technology. Micromechanical devices, including actuators, motors, and sensors, are projected to have applications in robotics, instrumentation, medical probes, space-based systems, and sensor arrays. Recent research results have shown that moving parts, such as gears, linkages, and motors, can be fabricated using modified silicon processing techniques. The proposed research seeks to develop a CVD tungsten-on-silicon technology to fabricate fully released, movable microstructures for actuators and motors. Specifically, the goals of this research include: (1) to develop a tungsten-silicon technology to produce stress-free, movable microstructures, (2) to fabricate a linear, electrostatic actuator with 10 micron travel using the tungsten-silicon technology, (3) to fabricate test structures to measure and characterize friction and stress for tungsten-silicon microstructure systems, (4) to fabricate a linear micromotor, and (5) to identify the key science and technology issues for future research and development of microelectromechanical systems.