Advances in Design of Automated Wire and Die Bonding Machinery in Microelectronic Manufacturing

这项研究解决了在微电子制造中以非常高的生产能力执行芯片和引线键合操作的自动化机械中出现的两个独立问题。机械设计中的问题是由于对热传递和金属与金属以及金属与半导体连接问题的基本认识不足，部分原因是材料界面上的扩散。这项研究考虑了每一个问题，并通过物理/数值模拟相结合的实验方案来解决这些问题。实验室设施可用于实验研究，大型计算机可用于数值模拟。

This research addresses two discrete problems that have arisen in the automated machinery that performs the die and wire bonding operations in microelectronic manufacturing with very high throughput. The problems in machine design are a result of inadequate fundamental understanding of problems in heat transfer and metal to metal and metal to semiconductor bonding partly due to diffusion at the material interface. The research considers each of these problems and addresses the solution through a combined experimental program with physical/numerical modeling. Laboratory facilities are available for the experimental research and access to large scale computers is available for the numerical modeling.