State IUCRC for The Integrated Electronics Engineering Center Performing Research in Electronics Packaging

综合电子工程中心的使命 （1）支持综合 纽约州的电子工业， 研究、开发和规划工作，⑵传播 研究的结果，这将推动领先的优势， （3）提供技术转让， 促进纽约州经济发展的培训计划， 以及（4）在融合中提供独特的教育体验 电子设计和组装在本科和 研究生水平。 IEEC的目标和目的可以是 分为三个活动领域：（1）研究和 （2）与工业界的合作活动，其他 学术机构和政府机构，以及（3）经济 发展，包括创业和劳动力 提高生产率和稳定性。 该组织框架将包括一个工业 咨询委员会（IAB）与工业界进行正式联络。 此外，将有一个项目联络员骨干， 工业直接与教师研究人员在每个 技术项目。 IAB有来自IBM，GE， 通用仪器，国家的大学工业公共 经济增长合作伙伴关系（UnIPEG）和沃森学院 工程. IAB的目的是提供一个合作的 沃森学校和电子学之间的技术互动 包装行业，通过建立更广泛的工业共识 最关键的包装主题，并鼓励 大学研究人员的跨学科活动。 国家领先的两年制学术机构将为 作为扩大技术转让机制的传递者， 国家的其他地区。 研究成果将 传播方式：（一）通过以下途径向IEEC成员初步报告 定期举行中心简报会，随后，（二） 在公共论坛上发表或介绍，然后，㈢ 任何公众人士均可参加的训练工作坊，但须缴付课程费用 基础 额外的课程将在本科和 超过沃森学校已经提供的研究生水平 在电子封装中。 除了研究成果的转移 结果直接给赞助商，有前景转移到 通过积极参与， 教师与国家机构，如大学/工业公共 经济增长伙伴关系及其工业 技术推广服务。 继续教育 沃森学校办公室将开发一些短期课程 有关中心的实施再培训计划， 地方微电子工业在个人一级 从而提高生产力和/或就业 稳定 纽约州、工业界和NSF将提供 第一年的配套资金总额为75万美元。

The mission of the Integrated Electronics Engineering Center (IEEC) will be four-fold: (1) to support the integrated electronics industry of New York State with short-and long-range research and development and planning efforts, (2) to disseminate the results of research which will advance the leading edge of technology in the field, (3) to provide a technology transfer and training program to enhance economic development in New York State, and (4) to deliver a unique educational experience in integration of electronics design and assembly at the undergraduate and graduate level. The goals and objectives for IEEC can be classified into three areas of activities: (1) research and development, (2) collaborative activities with industry, other academic institutions and government agencies, and (3) economic development, including business start-up and work force productivity and stability enhancement. The organizational framework will include an Industrial Advisory Board (IAB) for formal liaisons with industry. Additionally, there will be a cadre of Project Liaisons from industry working directly with faculty researchers on each technical project. The IAB has representatives from IBM, GE, Universal Instruments, the State's University Industry Public Partnership for Economic Growth (UnIPEG), and the Watson School of Engineering. The purpose of the IAB is to provide a collaborative technical interaction between the Watson School and the Electronics packaging industry, by establishing broader industrial consensus on the most critical packaging topics, and by encouraging interdisciplinary activities among university researchers. Leading two-year academic institutions in the State will serve as transmitters for amplifying the technology transfer mechanism to other regions of the state. Research results will be disseminated by: (i) reporting initially to IEEC members via regularly scheduled Center briefing sessions, followed by, (ii) publications or presentations in public forums, followed by, (iii) training workshops open to any member of the public on a course fee basis. Additional courses will be offered at the undergraduate and graduate level beyond those already provided by the Watson School in electronics packaging. Aside from the transfer of research results directly to sponsors, there is the prospect of transfer in the longer term to other firms through the active involvement of faculty with state agencies, such as the University/Industry Public Partnership for Economic Growth (UnIPEG) and their Industrial Technical Extension Service (ITES). The Continuing Education Office of the Watson School will develop a number of short courses related to the Center's implementation retraining programs for the local microelectronics industry at the level of the individual employee, thereby improving productivity and/or employment stability. The State of New York, industry and NSF will provide matching funds totalling $750,000 in the first year.