Dynamics of Excimer Laser Ablation in Plasma Environments

拟议的研究计划是一个综合性的实验 紫外准分子激光烧蚀的动力学研究 材料在等离子体和气体环境中的对比。 这将是 研究预电离激光烧蚀的第一批实验 等离子体背景在宽范围的填充气体压力，从 大气压至1 mTorr。 本研究的目的是 建立等离子体激光烧蚀加工知识库 与可用于工程应用的气体相比， 作为微电子学、微机械加工、烧蚀蚀刻 材料合成和燃烧。 研究将在 关于激光烧蚀物质相互作用的两个重要事例 （等离子体、中性原子和微粒）与1）背景 等离子体与不反应的气体，以及2）等离子体与 可支持氧化、氮化或燃烧的气体。 物种分辨激光探测诊断测量将是 进行表征准分子激光烧蚀羽流种类 动力学 激光烧蚀辅助放电实验将在 适用于快速加热、消融和 材料的电离。 拥有完善的实验设施 本研究，包括：准分子激光器（KrF和XeCl），染料 激光器、CO2激光器、红宝石激光器和铜蒸气激光器，以及 广泛的光谱设备。 在这项研究中获得的知识可能会带来突破 材料加工和合成技术。 任何发现 将扩大微制造的技术基础， 电子、光电子、制造和机床 行业

The proposed research program is a comprehensive experimental investigation of the dynamics of ultraviolet excimer laser ablation of materials in plasma versus gas environments. These will be the first experiments to investigate laser ablation in pre-ionized plasma backgrounds over a wide range of fill gas pressure, from atmospheric to 1 mTorr. The objective of this research is to develop a knowledge base on laser ablation processing in plasmas versus gases which can be usef for engineering applications, such as ablative etching of microelectronics, micromachining, ablative material synthesis, and combustion. Research will be performed on two important cases concerning interaction of laser-ablated matter (plasma, neutral atoms, and particulates) with 1) background plasmas versus gases which are nonreacting, and 2) plasmas versus gases which can support oxidation, nitriding, or combustion. Species-resolved laser probing diagnostic measurements will be performed to characterize excimer laser ablation plume species dynamics. Laser-ablation-assisted-discharge experiments will be performed with applicability to rapid-heating, ablation and ionization of materials. Complete experimental facilities exist for this research, including: excimer lasers (KrF and XeCl), dye laser, CO2 laser, ruby lasers, and copper vapor laser, as well as extensive spectroscopic facilities. The knowledge obtained in this research could lead to breakthroughs in materials processing and synthesis techniques. Any discoveries will expand the technology base for fabrication in the micro- electronics, opto-electronics, manufacturing, and machine tool industries.