RIA: Novel Millimeter-Wave Power Combining Structures

这个研究启动奖将调查小说 毫米波功率合成方法 结构. 几个新的网络和空间 提出了功率组合结构。 这些 电路可以联合收割机产生的电力 以毫米为单位的三个终端设备的数量- 波区 所提出的功率组合 结构是平面的和周期性的。 这些组合 结构适合于晶片级集成。 提出了一种二维功率合成器 它使用了Rucker的多设备对称 振荡器作为第二级功率合成电路。 在这种情况下，可以组合更多的设备， 可以更有效地利用芯片的真实的状态。 的 多个器件-电路相互作用， 组合器将使用黑川的研究 方法和稳定运行的标准将是 测定 这些组合器将被设计和 在35 GHz下工作。 噪声 性能，频率稳定性，可靠性因素， 高次谐波和功率合成效应 所提出的组合结构的效率将 被确定。

This Research Initiation Award will investigate novel approaches in millimeter wave power combining structures. Several new network-based and spatial power combining structures are proposed. These circuits can combine the power generated by large number of three terminal devices in the millimeter- wave region. The proposed power combining structures are planar and periodic. These combining structures are suitable for wafer scale integration. Also a two dimensional power combiner is proposed which uses Rucker's multi-device symmetrical oscillator as a second level power combining circuit. In this case, more devices can be combined and the chip's real state can be used more efficiently. The multiple device-circuit interaction for the proposed combiners will be investigated using Kurokawa's method and the criteria for stable operation will be determined. These combiners will be designed and fabricated for operation at 35 GHz. The noise performance, frequency stability, reliability factors, effect of higher harmonics and power combining efficiency of the proposed combining structures will be determined.