AMPP: Interfacial Processing and Adhesion of Titanium, Nitride, Diamondlike and Diamond Films on Metallic and Polymer Substrates

金刚石、类金刚石和氮化钛薄膜具有非常理想的化学、电气和机械性能，适用于从耐腐蚀和耐侵蚀涂层到微电子器件的电子封装等各种应用。然而，由于这些薄膜与金属和聚合物衬底的附着力差，许多这些应用受到限制。薄膜的附着力主要取决于薄膜内部的应力、热与晶格的失配，最重要的是由界面键合决定。需要沉积这些薄膜的技术，以及基于选择性激光和离子束照射界面区域的方法，以提高聚合物、金刚石和类金刚石薄膜与衬底之间的附着力。提出的研究解决了以下技术重要性系统中的界面加工和粘附现象：铜，钨，钛，氮化钛和聚合物衬底上的类金刚石，氮化钛和金刚石薄膜。硅烷粘结促进剂可以改善聚合物对金属基材的粘结，但金属对聚合物基材的粘结必须依靠界面处理。对于聚合物衬底，将使用非常薄的钛缓冲层来改善类金刚石和聚合物衬底之间的附着力。C（金刚石）与底物之间的亲和力从铜的零到钛和钨的非常高的程度不等。提出的研究重点是：a)界面处理，以提高附着力；B)界面表征，薄膜性能和粘附测量，以及c)建模以评估界面应力、应变和韧性，并了解粘附和界面键合机制。界面的结构和化学组成将作为激光、离子束和衬底参数的函数进行研究。将对薄膜和界面内的应力和应变进行建模，并将结果与这些薄膜的附着力测量相关联。

9311343 Narayan Diamond, diamondlike and titanium nitrade films have extremely desirable chemical, electrical and mechanical properties for a variety of applications ranging from corrosion and erosion resistant coatings to electronic packaging of microelectronic devices. However, many of these applications are limited by poor adhesion of these films with metal and polymer substrates. The adhesion of a film is determined primarily by internal stresses in the film, thermal and lattice mismatch, and most importantly by interfacial bonding. Techniques are required to deposit these films, and methods based upon selective laser and ion beam irradiation of interfacial regions to improve adhesion between polymer, diamond and diamond like films and the substrate. The proposed research addresses interfacial processing and adhesion phenomena in the following systems of technological importance: diamondlike, titanium nitrade and diamond films on copper, tungston, titanium, titanium nitride, and polymer substrates. The adhesion of the polymer to the metal substrate can be improved through the silane adhesion promoters, but the adhesion of metal to the polymer substate must rely on interfacial processing. For polymer substrates, a very thin buffer layer of titanium will be used to improve adhesion between diamondlike and polymer substrates. The affinity between C (diamond) and the underlying substrates varies from zero for copper to a very high degree for titanium and tungston. The proposed research emphasizes: a) interfacial processing to improve adhesion; b) interface characterization, properties of thin films and adhesion measurement, and c) modeling to evaluate interfacial stresses and strains and toughness and to understand the adhesion and interfacial bonding mechanisms. The structure and chemical composition of the interfaces will be studied as a function of laser, ion beam, and substrate parameters. Modeling of stresses and strains within the film and t he interfaces will be carried out and the results correlated with adhesion measurements of these films.