Computer-Generated Optimum Hardwood Log Sawing Using Internal Defect Information
Computer-Generated Optimum Hardwood Log Sawing Using Internal Defect Information
批准号:
9313081
负责人:
Luis Occena
金额:
$17.39万
依托单位国家:
美国
项目类别:
Continuing Grant
财政年份:
1993
资助国家:
美国
项目状态:
已结题
起止时间:
1993-09-01 至 1997-08-31
中文摘要
多年来,人类锯木工一直是根据外部缺陷提供的有限信息来决定锯片的放置位置,而任何内部缺陷最终都是通过锯切模式在被切割的原木表面上显示出来的。如何锯切硬木原木以提高高价值木材的回收率的规划受到锯切机无法“看到”原木内部缺陷的位置、方向和分布的阻碍。随着出口和国内市场的扩大、原木质量的降低、来自非木材产品的竞争加剧、管理非木材资源公共土地的社会压力以及原木成本和木材加工之间的利润率下降,硬木产品行业一直在探索提高价值产出的替代方法。这提供了科学和技术为基础的方法和信息,将有利于硬木产品行业通过提高产品产量。最近在光子层析成像和其他非侵入性固体内部扫描方法的应用方面的工作为测井击穿规划问题开辟了新的途径。对于与内部缺陷相关的新信息,如何将这些新信息发挥最大优势的问题就出现了。我们需要识别每个缺陷吗?我们如何处理、组织和解释内部缺陷信息?我们如何用它来确定初级加工的锯切量?我们可以将这些信息用作二次处理的前瞻信息吗?
英文摘要
9313081 Occena Over the years, the human sawyer has been making saw placement decision based on limited information provided by external defects, and whatever internal defects are eventually revealed on the cut log faces by the sawing pattern. The planning of how the hardwood log can be sawn to improve recovery of high value lumber is hampered by the inability of the sawyer to "see" the internal defect location, orientation, and distribution inside the log. With expanded export and domestic markets, low quality logs, increased competition from non wood products, social pressures to manage public lands for nontimber resources, and the reduced profit margin between log costs and lumber process, the hardwood products industry has been exploring alternative means of improving value yield. This provides science and technology based methods and information that will benefit the hardwood products industry through improved product yield. The recent work on the application of photon tomography and other means of non invasive internal scanning of solids have opened up new avenues in the log breakdown planning problem. With new information related to internal defects, questions arise on how this new information can be put to best advantage. Do we need to recognize each defect? How do we process, organize, and interpret the internal defect information? How do we use it to determine sawing cuts for primary processing? Can we use this information as a look ahead for secondary processing?
期刊论文(0)
专著(0)
科研奖励(0)
会议论文
Planning Grant: Mid-Missouri Center for Manufacturing and Information Technology Education
-
批准号:0302797
-
项目类别:Standard Grant
-
资助金额:$7.0万
-
财政年份:2003
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负责人:Luis Occena
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依托单位:
A Modular Approach to Learning System Integration and Control
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批准号:9351789
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项目类别:Standard Grant
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资助金额:$3.28万
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财政年份:1993
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负责人:Luis Occena
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依托单位:
Engineering Faculty Intership: System Information Integration
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批准号:9214719
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项目类别:Standard Grant
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资助金额:$0.7万
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财政年份:1992
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负责人:Luis Occena
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依托单位:
Japanese Language Award for Luis Occena
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批准号:9107412
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项目类别:Standard Grant
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资助金额:$0.64万
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财政年份:1991
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负责人:Luis Occena
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依托单位:
Logic-Based Geometric Spatial Reasoning
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批准号:9019470
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项目类别:Standard Grant
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资助金额:$1.2万
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财政年份:1990
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负责人:Luis Occena
-
依托单位:
国内基金
海外基金
基于多重计算全息片(Computer-generated Hologram,CGH)的光学非球面干涉绝对检验方法研究
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批准号:62375132
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项目类别:面上项目
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资助金额:54.00万元
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批准年份:2023
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负责人:马骏
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依托单位: