Boron nitride nanosheets for low energy consumption self-cooling devices

本计画旨在探讨应变二维材料自冷却热管理之热输运机制。它预计将产生有关其独特热特性的新知识，指导电子产品中产生的废热的使用以进行自冷却。预期成果包括一种新的节能热管理策略，以及增强在二维材料中设计热传输的能力，这些材料将部署在封装和高密度电子产品中，以克服过热问题。这将为经济和环境带来显著的好处，例如降低热管理技术的成本、能耗和二氧化碳排放。

This project aims to investigate the thermal transport mechanism of strained two-dimensional materials for self-cooling thermal management. It expects to generate new knowledge about their unique thermal properties, guiding the use of waste heat generated in electronics for self-cooling. Expected outcomes include a novel energy-effective thermal management strategy and enhanced capacity to engineer thermal transport in two-dimensional materials that will be deployed in miniaturised and high-density electronics to overcome overheating problems. This will provide significant benefits to the economy and the environment, such as reduced cost, energy consumption and CO2 emissions in thermal management technologies.