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SBIR Phase II: Conformal Ion Implantations Development for Surface Modification

SBIR Phase II: Conformal Ion Implantations Development for Surface Modification
SBIR 第二阶段:表面改性的共形离子注入开发
批准号:
9531388
负责人:
Richard Adler
金额:
$35.92万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
1997
资助国家:
美国
项目状态:
已结题
起止时间:
1997-07-15 至 2000-06-30

项目摘要

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中文摘要
翻译
离子注入可以改变表面的性质而不改变衬底。该技术在减少金属表面磨损和腐蚀方面的应用越来越广泛。由于植入通常是一个“视线过程”,许多此类应用都受到了限制。等离子体源离子注入(PSII)有潜力克服这一限制,只要等离子体在整个植入期间能够“符合”表面。等离子体密度和电力系统驱动条件的限制通常会限制植入物与表面的贴合程度。通过增加等离子体密度和功率系统峰值功率,可以克服这些限制,从而显著改善植入物的均匀性,并随后增加植入物作为表面改性技术的实用性。在第一阶段,我们通过实验证明,我们可以制造出一个系统,在这个系统中,等离子体与被植入物体的一致性在1-2厘米内。这是通过改进等离子体源和为植入提供动力的脉冲功率系统来实现的。在我们提出的第二阶段计划中,我们将升级NSRC现有的脉冲功率设备,并建立一个新的高密度等离子体源,以便在高功率下进行这种类型的保形植入。所提出的技术将有可能将植入应用于“凹凸不平”的表面,如模具和模具。这将增加该技术的应用范围,并提高模具寿命。
英文摘要
DMI-9531388 Adler Ion implantation can change the properties of a surface without changing the underlying substrate. This technology has growing applications in wear reduction and corrosion reduction of metal surfaces. Many of these applications have been limited by the fact that implantation is usually a "line of sight process. Plasma source ion implantation (PSII) has the potential to overcome this limitation as long as the plasma can be made to "conform" to the surface throughout the implant's duration. Limitations in plasma density and power system drive conditions often limit the degree to which the implant conforms to the surface. By increasing the plasma density and power system peak power, those limitations can be overcome, leading to a significant improvement in the uniformity of the implant and a subsequent increase in implant utility as a surface modification technique. In phase I we demonstrated through experiments that we could produce a system in which the plasma conformed to the object being implanted to within 1-2 cm. This was accomplished through improvements in the plasma source, and in the pulsed power system which powers the implantation. In our proposed phase II program, we will upgrade existing pulsed power equipment at NSRC and build a new high density plasma source in order to perform conformal implants of this type at high power. The proposed technology will make it possible to apply implantation to surfaces which are "bumpy" such as dies and molds. This will increase the range of applications over which this technique can be used and improve tool die lifetime.
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