NSF/EPA: Environmentally-Benign Processing Low Dielectric Constant Polymers for Microelectronics Applications

摘要- Raupp - 9613377 这项研究的动机是需要提高薄膜材料在微电子器件中的性能，以及在微电子制造中生产这些材料的成本效益和环境友好的工艺。 全球目标是调查与气相沉积聚合物实施相关的关键基础加工和材料科学障碍，气相沉积聚合物是一种有前途的介电选择，可解决这些性能，成本和环境技术驱动因素。 本研究针对多层互连中金属间介电应用的低介电常数薄膜聚对二甲苯和聚酰亚胺。 PI将同时研究聚合物薄膜的化学气相沉积（CVD）以及相关的CVD室清洁和聚合物蚀刻。 与摩托罗拉公司的工业专业人士合作，和Olin化学品，实际工艺整合问题以及这种替代技术对环境、安全和健康的影响将在本研究的每一步进行评估。 这种综合方法将提供全面的技术转让包，以促进工业实践中的实施。 该技术预期的主要环境效益如下：（1）气相沉积避免了溶剂基旋涂工艺及其相关的空气排放和液体废物;（2）采用单体回收和再循环的气相沉积具有接近零排放操作的高潜力;（3）通过适当的反应器设计和工艺控制应减少对CVD室清洁的需要;以及（iv）可以用基于氧的等离子体进行室清洁和聚合物膜的沉积后蚀刻，消除了对通常用于蚀刻无机介电膜的全氟化合物（PFC）的需要。

Abstract - Raupp - 9613377 This research is motivated by the need for enhanced thin film materials' performance in microelectronics devices and cost-effective environmentally benign processes for producing these materials in microelectronics manufacturing. The global objective is to investigate critical fundamental processing and materials science barriers related to implementation of vapor deposited polymers, a promising dielectric option which addresses these performance, cost and environmental technology drivers. The research targets low dielectric constant thin film parylenes and polyimides for intermetal dielectric applications in multilevel interconnection. The PI's will simultaneously investigate chemical vapor deposition (CVD) of polymer thin films and associated CVD chamber cleaning and polymer etching. In collaboration with industrial professionals at Motorola, Inc. and Olin chemicals, the practical process integration issues and the environmental, safety and health impact of this alternative technology will be assessed in each step of this study. This integrated approach will provide a comprehensive technology transfer package to facilitate implementation in industrial practice. The expected principal environmental benefits of the technology are as follows: (1) vapor deposition avoids solvent-based spin-on processes and their associated air emissions and liquid waste; (ii) vapor deposition employing recovery and recycle of monomer has a high potential for near zero emission operation; (iii) the need for CVD chamber cleans should be reduced through appropriate reactor design and process control; and (iv) chamber cleaning and post-deposition etching of polymer films can be performed with oxygen-based plasmas, eliminating the need for perfluorocompounds (PFCs) commonly employed to etch inorganic dielectric films.