GOALI/IUCP: Modeling and Control of Wire Saw Manufacturing Processes

小行星9634889 钢丝锯是一种用于切割石头和木头的技术，已经有好几年的历史了，但今天它被用来切割用于光伏电池和半导体的硅片。 这些锯使用多根线和研磨浆料来从具有优异表面光洁度的硅锭生产薄的（大约300-400微米）、相对大直径（200-300毫米）的晶片。 本次奖学金是纽约州立大学斯托尼布鲁克和GT设备技术公司之间的学术联系与工业合作研究项目。将开发线锯工艺模型，以设计和制造下一代线锯，能够生产厚度小于300微米的晶片，切口损失在150-200微米之间。 技术方法将是开发锯切过程的力学和动态模型，该模型可用于设计刚度和张力控制策略以提高切片精度。 在工业合作伙伴设计原型之前，将使用实验和独特的散斑激光测量技术来验证模型和控制。 该项目将为电子制造中的这一重要工艺提供基本模型，从而提高从硅锭制造晶片时的质量和生产率。 这种设备的综合设计和控制方法有望减少切口损失和缺陷产品造成的浪费，为在全球市场竞争的设备制造商提供技术领先地位。

9634889 Kao Wire sawing is a technology that has been used for may years to cut stone and wood, but today is used to slice the silicon wafers used in photovoltaic cells and semiconductors. These saws use multiple wires and an abrasive slurry to produce thin (on the order of 300-400 micron), relatively large diameter (200-300 millimeter) wafers from silicon ingots with excellent surface finish. This Grant Opportunity for Academic Liaison with Industry cooperative research project between the State University of New York at Stony Brook and GT Equipment Technologies, Inc. will develop models for the wire sawing process to design and build the next generation of wire saw capable of producing wafers less than 300 microns thick with kerf losses of between 150-200 microns. The technical approach will be to develop a mechanics and dynamic model of the sawing process that can be used to design a stiffness and tension control strategy for improving slicing accuracy. Experiments and unique speckle laser measurement techniques will be used to validate the model and control prior to the industrial partner's design of a prototype. This project will provide a fundamental model for this important process in electronics manufacture, leading to improved quality and productivity when fabricating wafers from silicon ingots. An integrated design and control approach for this equipment promises to reduce waste through both kerf losses and defective products, giving a technological lead to equipment manufactures competing in global markets.