MRI: Acquisition of Instrumentation for a Thin Film Characterization Facility

抽象巴布 基金授予收购原子力显微镜能够处理样品大至150毫米直径的硅晶片，一个独立的纳米压痕仪，多波长光谱椭偏仪，和溅射沉积系统，以提高现有的薄膜表征实验室。 这些仪器将被用来生产金属薄膜被平面化，并确认这些薄膜的一些机械性能（硬度，弹性模量）和那些在浆料中的磨料粉末之间的初步实验所建议的关系。 在抛光过程中，将对硬度和弹性模量进行原位测量。 完整的晶圆尺度测绘抛光和清洗过程中表面形态和缺陷结构的演变，以确定晶圆内的不均匀性。

Abstract Babu Funds are awarded to acquire an atomic force microscope capable of handling samples as large as 150 mm in diameter silicon wafers, a stand-alone nanoindentor, a multiple wavelength spectroscopic ellipsomenter, and a sputter deposition system to enhance the existing thin film characterization laboratory. These instruments will be used to produce metallic films to be planarized and to confirm the relationships suggested by preliminary experiments between some of the mechanical properties (hardness, elastic modulus) of these films and those of the abrasive powders in the slurry. In situ measurements will be made of hardness and elastic modulus during polishing. Complete wafer scale mapping of the evolution of the surface morphology and defect structures during polishing and cleaning to determine within-wafer-non-uniformity.