CAREER: Geometry and Morphology Effects in Colloidal Adhesion

该项目将开发一种描述复杂几何和形态对微米级胶体与基材粘附性的影响的第一原理方法。这在美国半导体制造业中非常重要。描述粒子粘着的传统方法依赖于Derjaguin-Landau-Verwey-Overbeek(DLVO)理论或将粘着功与用于胶体变形的Derjaguin-Muller-Topov(DMT)、Johnson-Kendall-Roberts(JKR)或Mugis-Dugdale(MD)模型相结合的方法。这些方法只适用于理想体系。该方法将传统的范德华(VDW)力公式修改为描述水溶液中的粘附性。它将考虑衬底和胶体的复杂几何和形态，并将包括胶体和衬底的变形和粗糙度。对半导体社区感兴趣的几何和形态复杂的胶体-底物系统的描述将包括在内。接触附着力的测量将使用原子力显微镜(AFM)进行。胶体既是良好的模型材料，也是集成电路工艺中常见的污染物(SiO_2、Al_2O_3)。基板是集成电路加工的重要基板，在半导体工业中，该方法可直接应用于刻蚀后加工和化学机械抛光后的晶片清洗方案中。在生物医药行业，它可以用来改进植入物的灭菌过程。

This project will develop a first principle method for describing the effects of complex geometry and morphology on the adhesion of micron-scale colloids to substrates. This is of importance in the U.S. semiconductor manufacturing industry. Traditional approaches to describing particle adhesion rely on Derjaguin-Landau-Verwey-Overbeek (DLVO) theory or on approaches using the work of adhesion in conjunction with the Derjaguin-Muller-Toporov (DMT), Johnson-Kendall-Roberts (JKR), or Maugis-Dugdale (MD) models for colloid deformation. These approaches are only applicable for idealized systems.The proposed approach will modify traditional van der Waals (vdW) force expressions to describe the adhesion in aqueous solution. It will account for complex geometry and morphology of the substrates and colloids and also will include the deformation and roughness of the colloids and substrates. Descriptions of geometrically and morphologically-complex colloid-substrate systems of interest to the semiconductor community will be included. Measurement of the contact adhesion force will be performed with an atomic force microscope (AFM). The colloids are either good model materials or common contaminants in integrated circuit processing (SiO 2 , and Al 2 O 3 ). The substrates are important substrates for integrated circuit processing.In the semiconductor industry, the proposed approach could find immediate application in wafer cleaning protocols during post-etch processing and post-chemical-mechanical-polishing processing. In the biomedical industry, it could be used to improve implant sterilization processes.