SBIR Phase II: Monochromatic Micro X-ray Fluorescence Analysis Using Toroidal Crystal Optics

这个小型企业创新研究(SBIR)第二阶段项目将满足微电子行业对用于薄膜测量的改进的微型X射线荧光仪的需求。一种利用双弯曲晶体光学的单色显微X射线荧光(MMXRF)分析技术可以满足这一重大的市场需求。环形晶体可以基于衍射聚焦来自微聚焦X射线源的特征X射线。聚焦的光束是单色的，预计光束尺寸将比目前的MXRF系统小得多。这项技术将提供高灵敏度，并通过选择束流能量来增强对低Z元件的激发。此外，这项技术将显著提高高能X射线测量的速度。将开发一个原型MMXRF系统，其中包括一个模块化的双束系统，可以同时探测两个能量的样品。该技术在半导体制造领域的初步应用。随着半导体制造向更大的晶圆和更高水平的集成转移，一个晶圆可能需要数百个步骤。这些晶片的生产成本很高，而且很难修复。正在开发的仪器将提供元素和厚度分析，以尽早确定有缺陷的薄膜沉积，避免与生产线末端报废相关的重大损失。

This Small Business Innovation Research (SBIR) Phase II project will meet the demand from the microelectronics industry for an improved micro x-ray fluorescence instrument for thin film measurements. A new technique, monochromatic micro x-ray fluorescence (MMXRF) analysis using doublycurved crystal optics can meet this significant market need. A toroidal crystal can focus characteristic x-rays from a microfocus x-ray source based upon diffraction. The focused beam is monochromatic and the beam size is expected to be significantly smaller than that of current MXRF systems. This technique will provide high sensitivity and enhance excitation of low Z elements with the selection of beam energy. In addition, this technique will significantly increase the speed of high-energy x-ray measurements. A prototype MMXRF system will be developed that incorporates a modular dual beam system to probe samples with two energies simultaneously.The initial application of the technology is in the area of semiconductor manufacturing. As semiconductor manufacturing moves to larger wafers and higher levels of integration, a single wafer may require hundreds of steps. These wafers are expensive to produce and very difficult to repair. The instrument under development would provide elemental and thickness analysis to identify defective thin film deposition at the earliest opportunity, avoiding the considerable loss associated with rejections at the end of the production line.