Lab Based Unit Operations in Microelectronics Processing

我们的工作是对“电子材料和器件跨学科课程的开发：没有食谱的烹饪”（NSF奖# DUE - 9551520）中开发的教学方法的改编。我们的课程是为了帮助那些对微电子和相关行业的加工工程师感兴趣的本科生而开发的。本项目帮助学生深入了解微电子中常用的单元过程的基本物理和化学原理。这些单元操作包括等离子蚀刻、化学气相沉积、旋转涂层和化学机械抛光。此外，我们还向学生介绍先进的诊断工具，这些工具帮助我们设计了更先进的微电子实验。我们还开发了一个课程，使我们的学生获得急需的“软技能”。如果我们的学生要在他们的职业生涯中取得成功，这些都是必要的。这些软技能包括技术写作、口头陈述、安全意识和团队建设。我们已经扩大了我们的受众，包括参加暑期项目的高中生。通过这些暑期项目，我们希望招募那些代表性不足的学生进入科学和工程领域。

Engineering - Chemical (53)Our work is the adaptation of teaching methods developed in "Development of an Interdisciplinary Curriculum in Electronic Materials and Devices: Cooking Without Recipes" (NSF award # DUE - 9551520). Our curriculum has been developed to help undergraduate students who are interested in careers as processing engineers in microelectronics and related industries. This project helps students develop an in-depth understanding of the underlying physical and chemical principles in unit processes commonly used in microelectronics. These unit operations include plasma etching, chemical vapor deposition, spin coating, and chemical mechanical polishing. In addition we are introducing students to advance diagnostics tools which has helped us design more advanced microelectronics experiments.We have also developed a curriculum that enables our students to acquire much needed "soft skills". These are necessary if our students are to succeed in their professional careers. These soft skills include technical writing, oral presentation, safety awareness, and teambuilding. We have extended our audience to include high school students who have participated in summer programs. Through these summer programs we are hoping to recruit underrepresented students into science and engineering careers.