Laser Ultrasound-Interferometric System for Packaged Electronic Devices Quality Evaluations

该赠款提供资金，以开发一种新的质量检测系统，将评估包装电子设备的缺陷。这种缺陷将包括未对准、短路、缺失、破裂、空洞、分层、部分连接、开路、过多和饥饿的焊料凸块，这些焊料凸块出现在诸如倒装芯片（没有焊盘）、直接芯片附接（DCA）、芯片级封装（CSP）的封装器件中，以及芯片电容器和电阻器中的裂纹。PI建议开发一种自动化激光超声干涉测量系统，该系统使用单根光纤来评估封装电子设备的质量。该系统可在生产线中用作通/止检测工具，或在工艺开发过程中离线进行工艺优化。这将是一种高分辨率、非接触、非破坏性、低成本、快速准确的质量检测系统。PI还将制定一个信号处理程序，用于确定是否存在一个或多个此类缺陷。 将开发一个有限元分析模型来解释实验结果。 最后的目标是利用本研究中获得的经验，建立一个工业级的原型系统，用于在工业中进行Beta测试。 PI和他的学生将迅速将这项技术转移到行业中。这项研究将导致一个新的和自动化的非接触，非破坏性的，快速，灵敏，准确和低成本的焊料凸点质量检测系统的发展。它还有望适用于许多类型的表面贴装器件，如芯片电阻器和电容器，以及传统的引线框架封装，使其成为一种通用且具有成本效益的自动化制造工具。该工具可在线用作通/止检测工具，并在工艺开发过程中离线用于工艺优化。使用这种新的激光超声干涉检测技术进行自动化制造检测，将通过在工艺早期发现缺陷来节省大量成本。 通过使用快速、准确的检测系统，还可以通过缩短新产品上市时间，并在生产加速前进行更好的工艺优化，从而在工艺开发中实现成本节约。如果研究目标得到充分实现，所提出的技术将有助于提高产量的数字电路，倒装芯片，CSP，硅芯片，芯片电阻和电容。该研究将通过培训这些学生开发和应用低成本和高性能传感器，对微电子封装器件的在线和离线质量评估产生影响。参加这项研究的学生将学习如何在微电子封装、激光超声、光学技术、系统集成、信号处理和有限元建模方面进行应用和基础研究。他们还将学习技术许可和商业化

This grant provides funding to develop a novel quality inspection system that will evaluate the defects in packaged electronic devices. Such defects would include misaligned, short, missing, cracked, voided, delaminated, partially connected, open, excessive and starved solder bumps that occur in such packaged devices as flip chip (with no underfill), direct chip attach (DCA), chip scale packaging (CSP), and cracks in chip capacitors and resistors. The PI proposes to develop an automated laser ultrasonic-interferometric system that uses a single optical fiber for evaluating the quality of packaged electronic devices. This system can be used in a production line as a go/no-go inspection tool, or off-line during process development for process optimization. This will be a high resolution, non-contact, non-destructive, low cost, fast and accurate quality inspection system. The PI will also develop a signal processing procedure for determining the presence of one or more of these defects. A finite element analysis model will be developed to explain the experimental results. The final objective is to use the experiences gained in the conduct of this study to build an industrial grade prototype system for use as a Beta test in industry. The PI and his students will swiftly transfer this technology to the industry. This research will result in the development of a novel and automated non-contact, non-destructive, fast, sensitive, accurate and low cost solder bump quality inspection system. It is also expected to be applicable to many types of surface mount devices such as chip resistors and capacitors, and conventional lead frame packages, making it a versatile and cost-effective automated manufacturing tool. This tool could be used on-line as a go/no-go inspection tool, and off-line during process development for process optimization. Use of this new Laser Ultrasound-Interferometric inspection technology for automated manufacturing inspection will bring tremendous cost savings by catching defects early in the process. With access to rapid, accurate inspection systems, cost savings will also be realized in process development by reducing the time to market new products, and allowing better process optimization before manufacturing ramp-up. If the research objectives are fully implemented, the proposed technique will help to increase the yield of DCAs, flip chips, CSPs, silicon chips, and chip resistors and capacitors. The research will impact the nation's human resources by training these students in the development and application of low cost and high performance sensors, for on-line and off-line quality evaluation of microelectronic packaging devices. The students who will be participating in this research will learn how to carry out applied and fundamental research in microelectronic packaging, on laser ultrasound, on optical techniques, on system integration, on signal processing and on finite element modeling. They will also learn about technology licensing and commercialization