Spreading Kinetics of Constrained Thin Films

密苏里州的Parthasakha NeogiU- Rolla“受约束薄膜的铺展动力学“液体在固体表面上铺展的速率称为润湿动力学，它涉及液体在固体表面上移动并置换第二种流体的速率。 由于液膜厚度随着接触线（固-液-汽三相的公共线）的接近而逐渐减小到零，因此薄液膜的特殊性质起着重要的作用。 这里重要的是分离压力，它与薄膜（小于100纳米）中的过量电势有关，并且可以用作体力来描述流体动力学和平衡。 分析研究的是液体在分离压力下对固体基质既有吸引力又有排斥力的情况，这是常见的，但没有分析过。虽然薄膜现象决定了液体是非润湿的，但在实验中，扩散本身的动力学似乎不受分离压力的影响，直到移动的液体突然平衡的时候。 这种行为是如何产生的定量描述将从本研究的结果中变得清晰。 运动液膜轮廓的流体力学方程将用数值方法求解。 数值方法是非常困难的，因为需要看两个非常不同的长度尺度，基本液体质量的尺度和薄膜尺寸，并且需要很长时间。 此外，液体蒸发和表面粗糙度的影响将被考虑，因为它们带来了大量的现实分析。

Parthasakha NeogiU of Missouri - Rolla"Spreading Kinetics of Constrained Thin Films"The rate at which a liquid spreads over a solid surface is called the wetting kinetics, which deals with the rates at which a liquid moves over a solid surface and displaces a second fluid. Since the liquid film thickness gradually decreases to zero as the contact line, the line common to the solid-liquid-vapor phases, is approached, the special properties of thin liquid films play an important role. Of importance here is the disjoining pressure, which is related to the excess potential in thin films (less than 100 nanometers), and can be used as a body force to describe the hydrodynamics and equilibrium. This analytical research is for a liquid that has both attraction and repulsion for the solid substrate in its disjoining pressure, which is common but has not been analyzed. Although the thin film phenomenon determines that the liquid is non-wetting, the dynamics of spreading itself seems unaffected in the experiments by the disjoining pressure until the time when the moving liquid suddenly equilibrates. A quantitative description of how such a behavior arises will be made clear from the results of this research. The fluid mechanical equations for the profile of the moving liquid film will be solved numerically. The numerical method is made very difficult by the need to look at two very different length scales, the scale of the basic liquid mass and the thin film dimensions, and over very long times. Additionally, the effect of liquid evaporation and surface roughness will be considered, since they bring in great deal of reality to the analysis.