A Multidisciplinary Integrated Capstone Design Curriculum for Electrical and Computer Engineering

提案编号：0230628主要出版商：戈德曼，尼尔机构名称：马里兰州大学园区标题：电气和计算机工程的多学科综合顶点设计课程摘要电气和计算机工程系（ECE）在马里兰州大学园区（UMCP）正在规划一个主要的本科课程修订的过程中。 这项规划拨款将用于顶点设计项目，这将大大修改，为高年级学生提供一个多学科的设计经验，并将大三和大四学生融入顶点体验。该团队将评估顶点体验的结果，以生成数据，指导我们的课程修订。顶点设计课程的一个主要目标是让学生在一个设计项目中工作，专业水平。该项目利用了学生在过去两到三年的ECE课程中获得的大部分知识。因此，Capstone设计经验的结果应该是一个很好的指标，说明ECE部门的教育过程对学生的职业生涯有多好。一年到一年的评估theCapstone设计课程的成果将使我们能够在大二，大三和大四的课程不断改进。在这种情况下，顶点计划的修订将作为推动整个ECE计划课程修订的引擎。

PROPOSAL NO.: 0230628PRINCIPAL INVESTIGATOR: Goldsman, NeilINSTITUTION NAME: University of Maryland College ParkTITLE: A Multidisciplinary Integrated Capstone Design Curriculum for Electrical and Computer EngineeringAbstractThe Department of Electrical and Computer Engineering (ECE) at the Universityof Maryland at College Park (UMCP) is in the process of planning a major curriculumrevision for its undergraduate program. This planning grant will address the Capstone designprogram, which will be greatly revised to provide a multidisciplinary design experiencefor senior students and to integrate juniors and sophomores into the Capstone experience.The team will assess the outcomes of the Capstone experience to generate data to guide the revision of our curriculum in general.A major objective of the Capstone design courses is for the students to work on adesign project at a professional level. The project makes use of most of the knowledgethat students have acquired in the previous two to three years of the ECE curriculum.Therefore, the outcome of the Capstone design experience should be an excellentindicator of the how well the education process in the ECE Department is preparingstudents for their professional career. A year-to-year assessment of the outcomes of theCapstone design courses will enable us to make continuous improvements in thesophomore, junior, and also the senior year curricula. This being the case, the revision ofthe Capstone program will serve as the engine to drive curriculum revision for the entireECE program.