NER: Silicon Insert Molded Plastics (SIMP)

这项研究的目的是开发一种具有亚微米三维特征的聚合物零件的注射成型工艺，如倾斜平面，使用一种我们称为硅插入模压塑料(SIMP)的工艺。假设可以使用微制造技术制造硅插件，允许纳米级的公差、光滑度和尺寸。特别是，利用硅的选择性蚀刻能力，用KOH以低成本获得与垂直方向成54.7度倾角的纳米光滑111平面(对于普通的100个晶片)，从外科工具到光纤耦合器，可以用111个平面制造大量精密产品，特别是，纳米精度平面和边缘的可用性可以彻底改变小型精密部件的设计方式。对SIMP工艺的研究将在四个方面取得进展。第一个领域是硅片的设计和制造。虽然微制造工艺正在变得标准化，但每个新零件都必须解决许多问题，特别是冷却通道或KOH蚀刻特征与DRIE特征相结合的特征。第二个研究领域必须考虑将硅插件集成到金属模具载体中，然后将该载体插入成型机中。例如，硅片上的热效应是聚合物加工的一个主要问题，模具寿命和精度问题。第三个研究领域是研究聚合物中纳米级特征的材料加工方面。具体地说，要解决的问题是确定可注塑特征的极限，以及发现改善聚合物加工性的技术。最后的研究领域包括部件的设计，以便更容易地成型任何纳米级的特征。本科生和研究生将与我们的工业合作伙伴--拜耳公司(聚合物事业部)、Schick和Teradyne Connection Systems--密切合作，帮助开发SIMP工艺，从而确保技术迅速转移到工业中。

The objective of this research is to develop a process for injection molding polymer parts with sub-micron three-dimensional features, such as angled planes, using a process we call Silicon Insert Molded Plastics (SIMP). It is hypothesized that silicon inserts can be manufactured using microfabrication techniques allowing for tolerances, smoothness, and dimensions at a nanoscale level. In particular, advantage would be taken of silicon's ability to be selectively etched for low cost with KOH to obtain nanometer smooth 111 planes at an inclination angle of 54.7 degrees from the vertical (for a common 100 wafer), There are a host of precision products from surgical tools to fiber optic couplers that can be created with the 111 planes, and in particular, the availability of planes and edges with nanometer precision can revolutionize the way small precision parts are designed.Research into the SIMP process will progress in four areas. The first area is the design and fabrication of the silicon inserts. While microfabrication processes are becoming standardized, many concerns must be addressed for each new part, especially for features such as cooling passages or KOH etched features combined with DRIE features. The second area of research must account for the integration of the silicon inserts into a metal mold carrier that is then inserted into the molding machine. For example, thermal effects on the silicon inserts are a major concern for processing of the polymer, mold lifetime and accuracy issues. The third research area investigates the material processing aspects of nanoscale features in polymers. Specifically, the issues to address are the determination of the limits of moldable features and the discovery of techniques to improve the processability of the polymers. The final research area encompasses the design of parts to allow for easier molding of any nanoscale features. Undergraduate and graduate students will be working closely with our industrial partners -- Bayer Corp. (Polymers Division), Schick, and Teradyne Connection Systems - to help develop the SIMP process thus ensuring rapid transfer of the technology to industry.