STTR Phase I: Improved Boron Nitride Materials for Enhanced Thermal Management

这一小型企业技术转让第一阶段项目为电子热管理应用提供了改进的氮化硼（BN）填充材料的制备。新型原子层沉积（ALD）纳米涂层用于选择性地仅对边缘或边缘/基面进行功能化，以改善BN片晶与树脂澄清剂的润湿性。改善的润湿允许在加工期间BN/树脂混合物的粘度显著降低（降低约5倍），并改善固化复合物中的界面粘附。这些改进是通过在单个BN片晶上使用超薄（nm厚）、保形、无针孔、化学键合的氧化铝纳米膜来实现的，其提供流变性能的改进而不显著降低热导率。因此，填充复合材料中较高的BN负载量将允许显著改善电子封装材料中的散热，特别是在球形顶部涂层和灌封化合物的情况下。将用约50、25、12.5、6.3、3.2、1.6和0.8纳米厚度的化学键合的Al 2 O3膜选择性地纳米涂覆单个细尺寸BN片晶颗粒（仅边缘或边缘/基面）。纳米涂层BN将以40体积%的负载量混合在液体密封剂混合物中（将测量粘度），固化，并测试热导率和剥离强度。商业上，这解决了电子工业中最紧迫的问题之一，即使用更快，更强大的芯片所需的散热。由于氮化硼作为填料具有最好的导热性之一，因此其性能的任何改进都可以积极解决这个问题。此外，成功的大规模加工的潜在影响远远超出了所提出的微电子封装应用。纳米科学只有在超细颗粒的单个表面能够被功能化的情况下才能达到真正的“颠覆性”技术地位。超细颗粒的ALD纳米涂层提供了这样的机会。现在可以生产具有设计的电，磁，光学，机械，流变或其他特性的超细颗粒。这种功能化超细粉体的市场包括微电子、国防、硬金属、化妆品、药物输送、高能材料和聚合物/陶瓷纳米复合材料等。更好地了解超细颗粒的纳米涂层及其成本/性能价值。

This Small Business Technology Transfer Phase I project provides for the manufactureof improved boron nitride (BN) filler materials for electronic thermal management applications.Novel Atomic Layer Deposition (ALD) nanocoating is used to selectively functionalize edges only or edges/basal planes to improve wetting of BN platelets with resin encapsulants. The improved wetting allows for significantly reduced viscosity (~ 5 times less) of BN/resin mixtures during processing and improved interfacial adhesion in the cured composite. These improvements are realized using an ultra-thin (nm thick), conformal, pin-hole free, chemically bonded alumina nanofilm on individual BN platelets that provides for an improvement in rheological properties without a significant reduction in thermal conductivity. Hence, higher BN loadings in filled composites will allow for significantly improved heat dissipation in electronic packaging materials, particularly in the case of glob top coatings and potting compounds. Individual fine sized BN platelet particles will be selectively nanocoated (edges only or edges/basal planes) with chemically bonded Al2O3 films of ~50, 25, 12.5, 6.3, 3.2, 1.6, and 0.8 nanometer thickness. The nanocoated BN will be blended at a 40 volume % loading in a liquid encapsulant mixture (will measure viscosity), cured, and tested for thermal conductivity and peel strength.Commercially this addresses one of the most pressing problems in the electronics industry, namely the heat dissipation required by the use of faster and more powerful chips. Since boron nitride has one of the best thermal conductivities as a filler, any improvement in its performance can positively address this problem. Furthermore the potential impact of successful large scale processing extends far beyond this proposed microelectronics packaging application. Nanoscience will only achieve true "disruptive" technology status if the individual surfaces of ultrafine particles can be functionalized. ALD nanocoating of ultrafine particles provides such an opportunity. It is now possible to produce ultrafine particles with designed electrical, magnetic, optical, mechanical, rheological, or other properties. Markets for such functionalized ultra-fine powders include microelectronics, defense, hard metals, cosmetics, drug delivery, energetic materials, and polymer/ceramic nanocomposites, among others. A better understanding of the nanocoating of ultra-fine particles and its cost/performance value will be developed.