SST: Damage-Tolerant, Stretchable, and Reconfigurable Silicon-based Piezoelectric Sensor Networks For Structural and Medical Diagnostic Imaging

[05:29357] peter Peumans & &； chang Fu-Kao斯坦福大学该项目旨在实现高密度和高性价比的高性能传感器网络，可部署在厘米到米的尺度上。在将网络“拉伸”到目标尺寸并“切割”到正确的形状之前，网络完全在CMOS代工厂中进行处理。采用创新的布局和深度反应离子蚀刻技术，从代工厂加工的硅片开始制造可拉伸传感器网络。每个传感器网络节点都是一个小的（~50-200mm直径），高性能硅集成电路，包含传感器，传感器接口，本地处理器和网络接口。网络的拉伸能力是通过将网络和电源连接实现为标准的CMOS互连，在配置为弹簧的窄硅脊上实现的。传感器网络具有损伤容忍度、可扩展性、可重构性、成本效益和耐用性。测试平台将是一个集成在复合层压板结构中的超声波传感器/换能器网络，以前所未有的空间和时间分辨率感知早期损伤。进一步的应用是高分辨率超声医学成像，超声诱导热疗引导化疗，以及用于国土安全的微波相控阵。该技术不仅可用于航空/航天/汽车/民用复合材料结构，也可用于金属结构偏远热点区域的疲劳裂纹监测。提出的电气工程与结构力学的多学科综合研究为从事本研究的学生提供了一个跨学科交流和互动的好机会。计划的研究将被纳入参与研究者所教授的课程中。与工业和高中学生的互动是提案的一个组成部分，也是“工程作为艺术”的倡议。这是传感器倡议NSF 05-526下的一个项目。

0529357Peter Peumans & Fu-Kao ChangStanford UniversityThis project is to realize very dense and cost-effective networks of high-performance sensors deployable on the centimeter to meter-scale. The networks are entirely processed in a CMOS foundry before they are "stretched" to the target size and "cut" to the right shape. An innovative layout and deep reactive ion etching to fabricate stretchable sensor networks starting with foundry-processed silicon wafers are used. Each of the sensor network nodes is a small (~50-200mm diameter), high-performance silicon integrated circuit that houses a sensor, sensor interface, local processor, and a network interface. The stretching ability of the network is achieved by realizing the network and power connections as standard CMOS interconnects on narrow silicon ridges configured as springs. The sensor networks are damage tolerant, scalable, reconfigurable, cost-effective and durable. The testbed will be an ultrasonic sensor/transducer network integrated into a composite laminate structure to sense incipient damage with unprecedented spatial and temporal resolution. Further applications are high-resolution ultrasound medical imaging, guided chemotherapy by ultrasound-induced hyperthermia, and microwave phased arrays for homeland security.The proposed techniques can be applied not only on composite structures in aero/astro/auto/civil applications, but also metallic structures for monitoring fatigue cracks in remote hot spot areas. The proposed integrated multi-disciplinary research among electrical engineering and structural mechanics provides a great opportunity for students engaging in this research to communicate and interact with each other across disciplines. The planned research will be integrated into the courses taught by the participating investigators. Interactions with both industry and high school students are an integral part of the proposal, as well as an "Engineering-as-Art" initiative.This is a project under the sensor initiative NSF 05-526.