Support for Student Attendance at the ACM Symposium on Solid and Physical Modeling; June 13-15, 2005; Cambridge, MA

支持学生参加ACM固体和物理建模研讨会的建议摘要2005年6月，麻省理工学院主办并共同赞助了形状和固体国际会议（网站：http://deslab.mit.edu/SM-SMI-2005/）。本次大会包括连续举行的两个著名研讨会，即年度实体和物理建模研讨会（6月13日至15日）和年度形状建模国际会议（6月15日至17日）。这些会议的第一次，ACM固体和物理建模研讨会（SPM '05），网站http://www.solidmodeling.org/spm.html，是本提案的主题。它是由计算机协会计算机图形学特别兴趣小组（ACM SIGGRAPH）共同主办的，是一个年度国际论坛，用于交流空间建模和计算在设计、分析和制造以及新兴生物医学、地球物理和其他领域的应用方面的最新研究。第二次会议，IEEE形状建模与应用国际会议（SMI '05），网站http://www.shapemodeling.org/，由电气和电子工程师学会计算机协会（IEEE- cs）共同主办，并提供了一个论坛，传播新的计算技术，用于建模和处理形状及其属性的数字表示，并在广泛领域的不同专家社区。这两个会议在国际上享有很高的声誉，吸引了高质量的论文。

PROPOSAL TO SUPPORT STUDENT ATTENDANCE AT THE ACM SYMPOSIUM ON SOLID AND PHYSICAL MODELINGAbstractIn June 2005, MIT is hosting and co-sponsoring the International Convention on Shapes and Solids (website: http://deslab.mit.edu/SM-SMI-2005/). This Convention comprises two prestigious symposia that are being held consecutively, namely, the annual Solid and Physical Modeling Symposium (June 13-15), and the annual Shape Modeling International Conference (June 15-17). The first of these conferences, the ACM Symposium on Solid and Physical Modeling (SPM '05), website http://www.solidmodeling.org/spm.html, is the subject of this proposal. It is co-sponsored by the Association for Computing Machinery Special Interest Group on Computer Graphics (ACM SIGGRAPH) and is an annual international forum for the exchange of recent research in applications of spatial modeling and computations in design, analysis and manufacturing, as well as in emerging biomedical, geophysical and other areas. The second conference, the IEEE International Conference on Shape Modeling and Applications (SMI '05), website http://www.shapemodeling.org/, is co-sponsored by the Institute of Electrical and Electronic Engineers Computer Society (IEEE-CS) and provides a forum for the dissemination of new computational techniques for modeling and processing digital representations of shapes and their properties to a diverse community of experts across a wide range of areas. The two conferences have an excellent international reputation and they attract very high quality papers.