Design Methodologies and Algorithms for Three-Dimensional Integrated Systems

CCF-0541206 PI：Friedman，Eby G. 罗切斯特大学：三维集成系统的设计方法和算法 摘要集成电路（IC）的引入使电子市场在过去几十年里得到了前所未有的发展。迄今为止，这种增长率已经被半导体工业放大电路的晶体管的尺寸所利用。这种扩展提供了具有更高性能和更大功能的系统。然而，由于物理和技术方面的一些限制，集成密度的增加无法继续。因此，IC设计界的研究重点一直致力于开发设计方法，为未来集成电路设计中的预测挑战提供有效的解决方案。一种新兴的设计范式是三维集成，其中第三维用于附加电路。通过第三维，相邻电路之间的距离大大减小，从而提高了系统的性能和密度。从我们的日常生活中可以描述一个简单的类比;两个相邻的建筑物之间的步行距离几乎总是比高层建筑中两个相邻楼层之间的距离更长。在本研究项目中，与3-D系统相关的重要设计问题进行了研究，以推进和扩散这一有前途的技术的知识。该项目强调集成电路可靠性设计的三个关键问题：开发设计方法，以使构成3D结构的每一层和各层之间的电路同步运行;提供设计策略，以有效地提供3D系统每一层电路稳定运行所需的功率;开发支持整个3D系统中信号无失真传播的技术。由于器件尺寸的变化，这一任务变得特别具有挑战性，因为器件之间的距离越近，信号之间的干扰就越大。这些方法将应用于各种电路，并将制造原型来证明所提出的设计技术和方法的有效性和局限性。

CCF-0541206 PI: Friedman, Eby G. Institution: University of Rochester Title: Design Methodologies and Algorithms for Three-Dimensional Integrated Systems AbstractThe introduction of the integrated circuit (IC) has led the electronics market to unprecented growth over the past several decades. This rate of growth has to date been leveraged by the semiconductor industry scaling the size of the transistors of the circuits. This scaling has delivered systems with higher performance and greater functional capabilities. The increase in integration density however cannot continue due to several limitations, both physical and technological. The focus of research in the IC design community has, therefore, been dedicated to the development of design methodologies that will provide effective solutions to predicted challenges in the design of future integrated circuits.An emerging design paradigm is that of three-dimensional integration, where the third dimension is utilized for additional circuitry. With the third dimension, the distance between neighboring circuits is greatly reduced, improving the performance as well as the density of the system. A straightforward analogy from our daily lives can be described; the walking distance between two neighboring building is almost always longer than the distance between two neighboring floors in a high rise building.In this research project, important design issues related to 3-D systems are investigated in order to advance and proliferate the knowledge in this promising technology. This project emphasizes three critical issues for the reliable design of integrated circuits:Developing design methodologies to synchronize the operation of circuits across each layer and among the layers making up the 3-D structure.Providing design strategies to efficiently deliver the required power for the robust operation of the circuits on each layer of the 3-D system.The development of techniques that support the undistorted propagation of signals throughout the 3-D system. This task has become particularly challenging due to device scaling, since the closer the devices are to each other, the greater the interference between the signals.These methodologies will be applied to various circuits, and prototypes will be fabricated to demonstrate the efficacy and limitations of the proposed design techniques and methodologies.