Thermal Transport at Nanoscale Point and Line Constrictions and Interfaces

美国国家科学基金会提案编号CTS-0553649美国德克萨斯大学附属大学首席研究员施正荣在奥斯汀的提案标题纳米尺度点和线的热输运和界面纳米尺度的点和线的收缩和界面的热输运是扫描探针显微镜、新型热界面材料和纳米结构电子和热电器件等技术的重要基础问题。到目前为止，几乎没有纳米尺度的收缩和界面热阻的测量结果。此外，尽管已经对两种固体之间的接触热阻进行了广泛的理论研究，但现有的大多数分析模型都是针对宏观到微观尺度的接触而建立的。该计划的研究目标是测量和模拟纳米尺度的点和线收缩以及界面上的热传输。超高真空原子力显微镜和纳米结构将被用来测量纳米尺寸的点接触、线界面和硅收缩的热阻。分子动力学(MD)模拟方法将被用来计算这些纳米尺度的收缩和界面处的热阻和温度分布。除了热传导外，计算还将研究近场和远场辐射传递对温度分布和热阻的影响。测量和计算的结果将被关联起来，并用于验证和改进分析模型。智力上的功绩。这项拟议的研究将获得纳米尺度收缩和界面处的热阻测量数据。测量和模拟的结果将填补知识空白，并为电子和热电设备的热设计和热管理以及新的扫描探针显微镜和数据存储方法提供及时的支持。这项研究将为参加NSF本科生研究体验(REU)计划的两名研究生和一名本科生提供培训机会。研究结果将作为两门研究生课程和一门新的本科技术选修课的案例研究。两名调查人员将在当地ASME学生组织的系列研讨会上进行简短演讲，并将积极参加由该大学主办的K-12外联活动。与工业研究人员的密切合作将对参与研究的学生进行教育并将从这项研究中获得的知识转化为工业应用，这将是互利的。

ABSTRACTNational Science FoundationProposal Number CTS-0553649Principal Investigator Shi, LiAffiliation University of Texas at AustinProposal Title Thermal Transport at Nanoscale Point and Line Constrictions and Interfaces Thermal transport at nanometer scale point and line constrictions and interfaces is a fundamental problem that is important for a number of technologies, such as scanning probe microscopy, novel thermal interface materials, and nanostructural electronic and thermoelectric devices. As of today, few measurement results of thermal resistances at nanoscale constrictions and interfaces are available. Moreover, although there have been extensive theoretical studies of contact thermal resistance between two solids, most of the existing analytical models have been developed for macro to micro scale contacts. The research objective of this program is to measure and model thermal transport at nanoscale point and line constrictions and interfaces. Ultrahigh vacuum atomic force microscopy and nanofabricated structures will be employed to measure the thermal resistance of nanometer size point contacts, line interfaces, and Si constrictions. A molecular dynamics (MD) simulation method will be used to calculate the thermal resistance and temperature distribution at these nanoscale constrictions and interfaces. In addition to heat conduction, the calculation will investigate the influences of near- and far- field radiation transfer on the temperature distribution and thermal resistance. The results from the measurements and calculations will be correlated and used to verify and improve analytic models. Intellectual Merit. The proposed research will obtain measurement data of thermal resistance at nanoscale constrictions and interfaces. The results from the measurements and simulations will fill in a knowledge gap and provide timely support for thermal design and thermal management of electronic and thermoelectric devices as well as new scanning probe microscopy and data storage methods.Broader Impacts. The research will provide training opportunities for two graduate students and an undergraduate student participant in the NSF Research Experience for Undergraduates (REU) program. The research results will be used as case studies in two graduate courses and one new undergraduate technical elective course. The two investigators will give short lectures in the seminar series organized by local ASME student organization, and will actively participate in K-12 outreach activities sponsored by the university. The close collaboration with an industrial researcher will have mutual benefits for the education of the participating students and the transfer of knowledge gained from this study for industrial applications.