A New Strategy for Multifunctional Polymer-based Substrates and Flexible Electronics
A New Strategy for Multifunctional Polymer-based Substrates and Flexible Electronics
批准号:
0824212
负责人:
Angus Kingon
金额:
$29.94万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2008
资助国家:
美国
项目状态:
已结题
起止时间:
2008-09-01 至 2012-08-31
中文摘要
这项研究的目的是开发和演示一种新的方法,以将增加的功能引入作为电子系统的主要(和普遍存在的)基板的高密度印刷线路板。该方法是一种混合加工方案,其中通过在逃逸金属箔上加工关键部件并与聚合物基板集成来补充传统的低温加工。这种方法将通过将氧化物热电材料与聚合物基板相结合来演示。热电设备将为模块提供热管理。第二个演示将是将开关晶体管集成到基于热敏电阻的灵活传感器阵列上。演示车辆的设计也是为了解决关键的、基本的加工和材料问题。该项目的智力优势在于针对低成本基板的新颖和优雅的加工策略,同时解决了电子行业面临的一个关键问题,即热管理问题。该项目预计将在电子行业产生广泛影响,通过使用普通高密度印刷线路板和灵活的电子系统可以实现的显著增加的功能。低成本、集成的主动热管理预计也将影响微电子模块。还将启用新的传感器阵列。此外,该项目将教育一名女性博士生,并将用于激励高中生追求STEM职业生涯,提醒他们注意能源问题,并吸引本科生参加研究生工程研究项目。该项目还将促进国际合作。
英文摘要
AbstractThe objective of this research is to develop and demonstrate a new approach to introduce increased functionality into high density printed wiring boards that are the primary (and ubiquitous) substrates for electronic systems. The approach is a hybrid processing scheme in which traditional low temperature processing is supplemented by processing of key components on fugitive metal foils and integration with the polymer substrates. The approach will be demonstrated by integrating an oxide thermoelectric material with the polymer substrate. The thermoelectric device will provide thermal management for a module. A second demonstration will be the integration of switching transistors on a flexible array of thermistor-based sensors. The demonstration vehicles are also designed to allow critical, basic processing and materials issues to be addressed.The intellectual merit of the project lies in the novel and elegant processing strategy for low cost substrates, while addressing a critical problem facing the electronics industry, namely that of thermal management. The project is expected to have broad impact in the electronics industry, through the dramatically increased functionality that can be achieved with the common high density printed wiring boards, and flexible electronic systems. Low cost, integrated active thermal management is also expected to impact microelectronic modules. New sensor arrays will also be enabled. Furthermore, the project will educate one female PhD student, and will be used to excite high school students into pursuing STEM careers, alert them to energy issues, and entice undergraduates into graduate engineering research programs. The project will also foster international collaboration.
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