SBIR Phase II: Fault Isolation of Open Circuits in Semiconductor Products using Magnetic Current Imaging

该小型企业创新研究（SBIR）第二阶段研究项目将通过扩展磁流成像功能，以10微米的精度检测半导体封装和集成电路中的开路故障。由于复杂性的增加和前沿设计的收缩，这已经成为当今行业遇到的最困难的问题之一。目前唯一可用的技术是时域反射测量法，其实际分辨率为1-2 mm，并且需要进行耗时的逐层去处理。迫切需要一种更快、非破坏性和更可靠的技术，能够在与接近10微米间距的封装级布线相当的水平上定位开口。建议使用超导量子干涉器件（SQUID）的磁电流成像，通过分析高频信号在缺陷位置的影响来解决这一关键需求。预计这种方法将能够以大约10微米的分辨率检测开路。这项研究的更广泛的影响是：它将使半导体公司能够通过快速发现和消除开路缺陷的来源，更快地将产品推向市场，并具有更高的可靠性;它将通过加速引进先进的电子产品，不断提高消费者的生活质量，并带来提高美国工业竞争力的机会收益。

This Small Business Innovation Research (SBIR) Phase II research project will enable detection of open circuit failures in semiconductor packages and integrated circuits with an accuracy of 10 microns by extending capabilities of magnetic current imaging. This has been one of the most difficult problems encountered by the industry today due to increasing complexity and shrinking of leading edge designs. The only technique available today is time domain reflectometry with practical resolution of 1-2 mm and time consuming layer-by-layer deprocessing. There is a critical need for a faster, non-destructive and more reliable technique capable of locating opens at a level commensurate with package level wiring approaching 10 microns pitch. It is proposed to use magnetic current imaging with a Superconducting Quantum Interference Device(SQUID) to solve this critical need by analyzing high frequency signals effects at the defect location. It is expected that this approach will be able to detect opens with a resolution of about 10 microns.The broader impacts of this research are: it will enable semiconductor companies to bring product to market faster and with greater reliability by rapidly finding and eliminating sources of open defects; it will benefit the nation by accelerating the introduction of advanced electronics that continuously improve quality of life for consumers, and bring opportunity gains that enhance the competitiveness of American industry.