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Chemical Mechanical Paired Grinding

Chemical Mechanical Paired Grinding
化学机械配对磨削
批准号:
1100066
负责人:
Abhijit Chandra
金额:
$41.5万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2011
资助国家:
美国
项目状态:
已结题
起止时间:
2011-07-01 至 2015-06-30

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中文摘要
翻译
该项目的目标是从研磨和抛光中获取关键见解,创造一种新的化学机械配对研磨技术,将固定磨料研磨和自由磨料抛光的优点结合起来,同时避免它们的缺点。这是通过结合磨削的关键弱点避免见解,即通过最小化每粒最大力来减轻缺陷,以及抛光的两个强度增强见解,通过轮廓驱动的力梯度确定有效的平面化以及通过均质化的稳健性来实现的。由此产生的实体体现在本项目将设计和建造的化学机械配对研磨机中。目前,当主要考虑表面质量和完整性时,可以选择价格相对昂贵的无磨料抛光,而如果主要考虑成本,则可以选择表面质量和完整性较低的固定磨料研磨。如果成功,化学机械配对磨削将通过以磨削的操作成本提供抛光的产品质量来消除这种权衡。它还将介绍一种新的技术,以结合优势和避免弱点的混合工艺设计。教育活动将包括将研究见解注入到设计和制造的研究生和本科生课程中,并为本科生提供实验室实习,其中所产生的化学机械配对研磨机将作为混合工艺设计的教学辅助工具。通过利用爱荷华州立大学现有的项目和与其他大学的交流项目,将为招收代表性不足的女性和少数族裔学生提供便利。
英文摘要
The objective of this project is to take key insights from grinding and polishing, and create a novel Chemical Mechanical Paired Grinding technology that combines the strengths of fixed abrasive grinding with those of free abrasive polishing, while avoiding their weaknesses. This is achieved by combining a key weakness avoidance insight from grinding, namely defect mitigation via minimization of maximum force per grit, with two strength enhancement insights from polishing, effective planarization via profile-driven determination of force gradient and robustness via homogenization. The resulting entity is embodied in a chemical mechanical paired grinding machine that will be designed and built in this project.Currently, relatively expensive free-abrasive polishing is the process of choice when surface quality and integrity are of primary concern, while fixed abrasive grinding with lower surface quality and integrity is used if cost is the primary design driver. If successful, chemical mechanical paired grinding will obviate this trade-off by delivering the product quality of polishing at a cost of operation for grinding. It will also introduce a new technique for combining strengths and avoiding weaknesses in hybrid process design. Educational activities will include infusion of research insights into graduate and undergraduate courses in design and manufacturing, and providing lab internships to undergraduate students where the resulting chemical mechanical paired grinding machine will be used as a teaching aid in hybrid process design. Recruitment of under-represented women and minority students will be facilitated by leveraging existing programs at Iowa State University and exchange programs with other universities.
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Rapid Process Development for Chemical Mechanical Planarization
  • 批准号:
    0900093
  • 项目类别:
    Standard Grant
  • 资助金额:
    $47.64万
  • 财政年份:
    2009
  • 负责人:
    Abhijit Chandra
  • 依托单位:
SGER / Collaborative Research : Multiscale Modeling: Finding Strengths, Avoiding Weaknesses
  • 批准号:
    0640826
  • 项目类别:
    Standard Grant
  • 资助金额:
    $0.0万
  • 财政年份:
    2006
  • 负责人:
    Abhijit Chandra
  • 依托单位:
Collaborative Research: Wire Sawing - Mechanics and Design Space Exploration
  • 批准号:
    0355536
  • 项目类别:
    Standard Grant
  • 资助金额:
    $35.53万
  • 财政年份:
    2004
  • 负责人:
    Abhijit Chandra
  • 依托单位:
Modeling and Control of Wafer Scale Yield Improvement in Chemical Mechanical Planarization (CMP)
  • 批准号:
    0323069
  • 项目类别:
    Standard Grant
  • 资助金额:
    $45.69万
  • 财政年份:
    2003
  • 负责人:
    Abhijit Chandra
  • 依托单位:
海外基金