PFI:AIR - TT: Novel Nanocomposite Solders for High Reliability Electronics Applications

这个PFI：空气技术翻译项目专注于翻译一种新型的高度可靠的无铅纳米复合焊膏(“纳米焊膏”)，以满足目前豁免的电子行业的需求，如国防、医疗和航空航天。纳米技术之所以重要，是因为它将使这些行业能够获得更环保的产品，而不需要依赖含铅组件和制造设施。这些行业目前不受禁止使用铅基焊料和组件的国际法规的约束，因为目前的无铅材料缺乏经过证明的可靠性。此外，获得含铅部件和制造设施正变得越来越困难，导致可靠材料供应的未来不确定。这项技术还可以惠及其他需要高可靠性的电子行业，如电力电子和通信。在该项目下，将开发一种适用于商业评估和生产测试的新型纳米复合焊膏的原型。纳米硅具有两个独特的特点：元素和成分均匀，以及制造过程中的加工温度较低。与这些细分市场中领先的竞争对手铅基焊料相比，这些特征提供了显著的优势，包括减少印刷电路板(PCB)上的热应力，提高焊点的可靠性。本项目将执行以下任务，以开发一种均匀的纳米焊料，以转化为商业应用：(1)扩大合成和配方，(2)通过电路板设计、模板印刷和焊料回流，制作具有纳米焊料的原型多组件测试车，以及(3)通过执行行业标准的电气和机械测试(剪切和拉力测试)和可靠性测试(热循环、腐蚀、振动和跌落试验)。此外，参与该项目的人员，包括本科生、研究生和博士后，将通过实验和分析、工业现场访问、定制访谈和业务发展获得创新、创业和技术转换经验。该项目与AIM焊接器、Benchmark Electronics和其他新英格兰无铅电子联盟关联成员(如雷神、飞利浦医疗保健、Teradyne和EMC)合作，以增强研究能力，提供测试环境，并指导这项技术转换工作中的商业化方面从研究发现到商业实现。

This PFI: AIR Technology Translation project focuses on translating a new highly reliable lead-free nanocomposite solder paste ("NanoPaste") to fill the need for the currently exempted electronic sectors such as defense, medical, and aerospace. The NanoPaste is important because it would give these industries access to a more environmentally friendly product that would not depend on leaded components and manufacturing facilities. These industries are currently exempt from international regulations banning the use of lead-based solders and components because of the lack of proven reliability of current lead-free materials. In addition, access to leaded components and manufacturing facilities is becoming increasingly difficult, making for an uncertain future of reliable supplies of materials. This technology could also benefit other electronic sectors that require high reliability, such as power electronics and communications. A prototype of the new nanocomposite solder paste will be developed under this project that is suitable for commercial evaluation and production testing. The NanoPaste has two unique features: homogeneous elements and compositions, and lower processing temperature during manufacturing. These features provide significant advantages, including reduced thermal stress on the printed circuit board (PCB) and enhanced reliability of solder joints, as compared to the leading competing lead-based solders in these market segments.The following tasks will be performed in this project in order to develop a homogeneous NanoPaste to translate to commercial application: (1) scale-up synthesis and formulation, (2) prototyping multi-component test vehicles with NanoPaste through board design, stencil printing, and solder reflow, and (3) full commercial characterization by performing industry-standard electrical and mechanical tests (shear and pull tests) and reliability tests (thermal cycling, corrosion, vibration and drop tests). In addition, personnel involved in this project, including undergraduates, graduates, and post-docs, will receive innovation, entrepreneurship, and technology translation experiences through experimentation and analysis, industrial site visits, custom interviews, and business development.The project engages AIM Solder, Benchmark Electronics, and other New England Lead-free Electronics Consortium associated members (such as Raytheon, Philips Healthcare, Teradyne and EMC) to augment research capability, provide test environment, and guide commercialization aspects in this technology translation effort from research discovery toward commercial realization.