SHF: Small: Reclaiming Dark Silicon via 2.5D Integrated Systems with Silicon Photonic Networks

与过去的应用相比，云、物联网和高性能计算等不断增长的领域中的新兴应用需要更高级别的并行性和更大的数据传输。在串联，功率和热约束限制的晶体管的数量，可以同时使用在芯片上，这种限制导致了？暗硅？问题.在充分利用计算机芯片潜力方面的这些困难加剧了构建高效高性能系统的挑战。该项目建议使用2.5D集成技术与硅光子片上网络（NOC）构建异构计算系统，提供所需的并行性，异构性和网络带宽，以满足下一代应用的需求。该项目的主要成果将是一套优化方法，这些方法将使具有硅光子NOC的2.5D系统的设计和操作更加高效和稳健。该项目旨在加速设计高性能、高能效的系统，以满足不断增长的带宽和性能需求，并通过这种方式实现更广泛的认知数据密集型应用。计划的教育和推广活动包括设计教程和讲习班，重点是培训未来的工程师跨层设计问题，让本科生、代表性不足的少数民族和女学生参与研究的各个方面，以及与研究中心和行业的互动，以加速技术转移。该提案的研究目标是为2.5D设计新颖的跨层设计自动化方法，集成异构系统与硅光子NOC，并定量展示这些2.5D系统在能源效率，鲁棒性和性能方面的优势。提出的工作桥梁之间的差距，器件，物理设计，架构和应用层的设计时，硅光子NOC系统，显着提高系统的效率和鲁棒性的差距。具体的项目重点包括设计：（1）量化跨层交互的建模堆栈（从设备到应用），并通知优化器，以实现节能的硅光子NOC设计和管理;（2）协调架构设计、小芯片放置、NOC设计/布线、激光器放置和冷却设计，以在功率和温度约束下最大化系统性能;（3）热感知设计/运行时间优化技术，其知道硅光子器件特性及其对热变化的敏感性;以及（4）跨层优化方法，帮助导航设计选择和运行时旋钮的复杂空间。

Emerging applications in the growing domains of cloud, internet-of-things, and high-performance computing require higher levels of parallelism and much larger data transfers compared to applications of the past. In tandem, power and thermal constraints limit the number of transistors that can be used simultaneously on a chip and this limit has led to the ?Dark Silicon? problem. These difficulties in harnessing the full potential of computer chips exacerbate the challenge of building efficient high-performance systems. This project proposes to use 2.5D integration technology with silicon-photonic networks-on-chip (NOCs) to build heterogeneous computing systems that provide the desired parallelism, heterogeneity, and network bandwidth to handle the demands of the next-generation applications. A major outcome of the project will be a set of optimization methods that will enable efficient and robust design and operation of 2.5D systems with silicon-photonic NOCs. The project seeks to accelerate the design of high-performance, energy-efficient systems that are able to cater to growing bandwidth and performance needs and, in this way, enable a wider spectrum of cognitive data-intensive applications. Planned educational and outreach activities include the design of tutorials and workshops focused on training future engineers on cross-layer design problems, involvement of undergraduate, under-represented minority, and women students in various aspects of the research, and interactions with research centers and industry to accelerate technology transfer.The research goal of the proposal is to design novel cross-layer design automation methods for 2.5D-integrated heterogeneous systems with silicon-photonic NOCs, and to quantitatively demonstrate the benefits of these 2.5D systems with respect to energy efficiency, robustness, and performance. The proposed work bridges the gap among device, physical design, architecture, and application layers when designing systems with silicon-photonic NOCs to dramatically improve system efficiency and robustness. Specific project thrusts include designing: (1) a modeling stack to quantify cross-layer interactions (from devices to applications) in a 2.5D system and inform optimizers to enable energy-efficient silicon-photonic NOC design and management; (2) design-time methods that orchestrate architecture design, chiplet placement, NOC design/routing, laser placement, and cooling design to maximize system performance under power and temperature constraints; (3) thermally-aware design/runtime optimization techniques that are aware of silicon-photonic device properties and their sensitivity to thermal variations; and (4) cross-layer optimization methods that help navigate a complex space of design choices and runtime knobs.