A fully integrated, multi-purpose Radio Front-End for wireless 100 Gbps (Real100G.RF)

该项目的主要目标是利用基于硅的规模经济，在200 GHz以上的无线千兆位通信方面取得技术突破。许多有前景的应用之一是数据亭中高达100Gbps的短距离高速无线数据传输，人们可以在几秒钟内将不同的大型内容，如电影，加载到他们的移动电子系统中。200 GHz以上的高载频可以利用25 GHz到50 GHz的高绝对带宽来实现具有高数据速率的超紧凑型无线电模块，同时保持适度的相对带宽(10%到20%)。这将允许使用低复杂性和低能耗的基带电路。在毫米波频率下，一个完整的射频前端可以在单个硅片上实现，并与天线阵列一起集成到单个芯片封装中。除了在这些频率的硅封装上实现电路和天线之外，该项目的主要挑战是找到克服非常有限的链路预算的概念。Real100G.RF2的提案将为SPP社区提供以下主要创新：-低成本、基于硅片、表面贴装的射频前端模块，支持100 Gbps无线短距离通信。为了实现这一目标，来自Pfeiffer教授和Zwick教授的两个小组必须密切合作。-200 GHz以上硅工艺技术中的宽带毫米波电路架构(Pfeiffer组)-超紧凑型表面贴装无线电模块概念和封装集成天线，包括完整的PC板概念(Zwick组)-新的基于硅的多天线前端概念，用于高速数据传输和波束控制(两组一起)-新颖的基于毫米波的前端系统架构，优化了100 Gbps数据传输的低能耗(两组一起)-系统测试，特别是与其他SPP研究小组(例如Real100G.COM)合作，以证明在成功实施主电路之后，为了验证预测的总体性能(两组一起)，第一阶段200 280 GHz的天线和封装创新第二阶段将致力于进一步优化和集成这些组件，以最终实现完整的收发机，这也允许与SPP中的其他研究小组一起进行系统测试。将雄心勃勃和具有挑战性的项目目标与最先进的技术相比较，很明显，即使只有一个单通道收发芯片与单元件天线集成，该项目也将导致距离最先进的技术水平迈出一大步。然而，它旨在评估用于超高数据速率传输的多信道收发机和具有简单波束控制能力的多天线系统的不同选项，以克服非常有限的链路预算。

The project's main objective is to leverage silicon-based economies-of-scale for a technology breakthrough in wireless multi-gigabit communication above 200 GHz. One of many promising applications is a short range, high-speed wireless data transmission of up to 100Gbps as in a data kiosk, where people can load different large contents as e.g. movies onto their mobile electronic systems over a distance of a few meters in just seconds. A high carrier frequency above 200 GHz can be used to achieve an ultra-compact radio module with high data rates using a high absolute bandwidth of 25 GHz to 50 GHz, while keeping the relative bandwidth moderate (10 % to 20 %). This would allow the use of baseband circuitry with low complexity and low energy consumption. At millimeter-wave frequencies, a complete RF front-end can be realized on a single silicon chip and integrated into a single chip package together with an antenna array. The major challenge of this project besides realizing circuits and antennas on silicon in a package at these frequencies is to find concepts to overcome the very limited link budget. The Real100G.RF2 proposal will make the following major innovations available to the SPP community:- Low-cost, silicon based, surface-mount RF front-end modules enabling 100 Gbps wireless short-range communication. To achieve this goal the two groups from Prof. Pfeiffer and Prof. Zwick must closely work together. - Wideband millimeter wave circuit architectures in silicon process technologies for above 200 GHz (Group Pfeiffer) - Ultra-compact surface-mount radio module concepts with package integrated antennas including a complete PC board concept (Group Zwick)- New silicon based multi-antenna frontend concepts for high-speed data transmission with beam steering (both groups together) - Novel mm-wave-based front-end system architectures optimized for 100 Gbps data transmission with low energy consumption (both groups together) - System tests especially in cooperation with other SPP research groups (e.g. Real100G.COM) to demonstrate the feasibility of the idea and to verify the predicted overall performance (both groups together) After the successful implementation of major circuit, antenna and packaging innovations at 200 280 GHz in phase 1 the second project phase will be dedication to further optimization and integra-tion of those components to finally achieve complete transceivers, which also allow system tests together with other research groups in the SPP. Comparing the ambitious and challenging project objectives with the state of the art, it becomes clear that the project would result in a vast step from the state of the art even if only a single channel transceiver chip is integrated with single element antennas. However, it is intended to evaluate different options for multi-channel transceivers for ultra-high data rate transmission and multi-antenna systems with a simple beam steering capability to overcome the very limited link budget.