FuSe-TG: Open, Multiscale, Application-Agnostic Platform for Heterogeneous System-in-Package Co-Design

异质集成(HI)在克服先进单片集成技术的成本和性能挑战以及有效克服摩尔定律的减慢方面显示出巨大的潜力。然而，HI在工程上是一个巨大的挑战，因为它必须同时解决将单独制造/设计的组件集成到更高级别的系统级封装(SiP)中的电气、光学、热、机械和材料挑战，以实现各种技术。目前，功能块和芯片的设计和优化是在不同的领域进行的，不同模型之间没有自洽的链接，它们之间没有共同设计或共同优化。如果该项目成功，将转化为整个微电子行业的持续创新，并使美国能够保持在微电子领域的全球领先地位，提供在未来几年实现超过摩尔规模的系统。这一合作项目将利用普渡大学刚刚启动的美国第一个半导体学位计划(SDP)，帮助满足未来微电子领域的劳动力需求。该项目将利用与中佛罗里达大学、加州大学圣巴巴拉分校和加州大学圣地亚哥分校的合作伙伴关系，以吸引代表人数不足的学生，并将与社区学院合作开发培训计划。该合作努力的技术目标是通过一个开放的、多尺度的、与应用程序无关的平台(Open-MAP)，在建模、模拟、优化和设计方面打破跨应用程序、设计领域和抽象级别的障碍，用于异类sip联合设计。OPEN-MAP包括三个关键部分：(1)多尺度多物理建模和分析，其具有第一原理的精度或用户期望的精度水平的无缝集成，并通过数据、ML辅助和不确定性量化技术进一步丰富；(2)一套多物理信息的设计和优化工具，用于自动化从意图到制造的协同设计；(3)将开展的一系列联合设计项目，以确定联合设计的关键障碍，告知和指导Open-MAP的发展，并最终利用Open-MAP功能展示联合设计的优势。该奖项反映了NSF的法定使命，并通过使用基金会的智力价值和更广泛的影响审查标准进行评估，被认为值得支持。

Heterogeneous integration (HI) has shown tremendous potential to overcome the cost and performance challenges of advanced monolithic integration technology and effectively combat the slow-down of Moore’s law. However, HI constitutes a grand challenge in engineering since it must simultaneously address the electrical, optical, thermal, mechanical, and material challenges of integrating separately manufactured/designed components into a higher-level System-in-Package (SiP), for a diverse range of technologies. Currently, the design and optimization of functional blocks and chips are implemented in different domains without self-consistent links between different models, and without co-design or co-optimization between them. This project, if successful, will translate to sustained innovations in the microelectronics industry at-large and permit the US to maintain global leadership in microelectronics, delivering systems that achieve more-than-Moore scaling for years to come. This teaming project will help meet the future workforce needs in microelectronics, utilizing the Nation’s First Semiconductor Degrees Program (SDP) just launched at Purdue University. The project will leverage partnerships with U of Central Florida, UC Santa Barbara, and UC San Diego, all minority-serving institutions to attract underrepresented students, and will also partner with Community Colleges to develop training programs.The technical objective of this teaming effort is to break the barriers across applications, design domains, and abstraction levels, in modeling, simulation, optimization, and design through an open-source, multiscale, application-agnostic platform (Open-MAP) for heterogeneous SiP co-design. Open-MAP encompasses three key components: (1) A multiscale multiphysics modeling and analysis seamlessly integrated with either first-principles accuracy or a user-desired level of accuracy, which is further enriched by data, ML-assisted, and uncertainty quantification techniques; (2) A suite of multiphysics-informed design and optimization tools to automate co-design from intent to fabrication; (3) A series of co-design projects that will be conducted to identify critical barriers to co-design, for informing and guiding the development of Open-MAP, and eventually demonstrating the co-design advantages using the Open-MAP capabilities.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.