SHF: SMALL: Multiphysics Simulation Algorithms and Experimental Methods for the Development of Cu/Graphene/TMD Hybrid Interconnect Solution

随着集成电路(IC)向更精细的特征尺寸和更高的集成水平发展，互连已成为IC技术发展的主要挑战。由于性能上的限制和/或制造上的困难，到目前为止开发的各种互连解决方案还不能取代铜(铜)互连。在本项目中，我们将通过模拟和实验来展示和探索新型的铜、石墨烯、过渡金属二卤化物(TMD)杂化互连线，它可以与相同尺寸的铜纳米线竞争，同时有可能成为最终的互连解决方案。参与这项工作的学生将接受广泛的技能培训，以保持未来纳米技术的进步。普渡大学伯克纳米技术中心的全纳课程和与文化相关的教学、纳米日等教育和推广活动也在进行中，以便让妇女和代表性不足的少数群体积极参与科学和工程工作。挑战是理解多物理现象之间复杂的相互作用，这些现象涉及电路、电磁学、材料、电子传输和宽频带内的热扩散。在实验上，快速的低温工艺是在沉积过程中保持铜纳米线结构完整性的关键，我们将对此进行研究。为了克服上述挑战，将寻求多物理模拟算法和实验方法。在实验方面，将开发一种低温化学气相沉积配方，以及等离子体增强工艺。将进行电和热传输测量，并与模拟相关联。

As integrated circuits (ICs) have progressed to finer feature sizes and higher levels of integration, interconnect has become a major challenge in IC technology development. Various interconnect solutions developed to date have not yet been able to replace Copper (Cu) interconnects due to their limitations in performance and/or difficulties in fabrication. In this project, novel Copper, Graphene, Transition Metal Dichalcogenide (TMD) hybrid interconnects will be demonstrated and explored by both simulations and experiments, which can compete with Cu nanowires with the same dimensions, and meanwhile have the potential to become the ultimate interconnect solution. The students who participate in this work will be trained with a broad range of skills to sustain future nanotechnology advancement. Education and outreach activities such as inclusive curriculum and culturally relevant teaching, Nano Days in the Birck Nanotechnology Center at Purdue, are also being developed to actively engage women and under-represented minorities into Science and Engineering.The entire physical process that takes place in a Cu/Graphene/TMD interconnect is yet to be fully understood. The challenge is to understand intricate interactions between multiphysics phenomena involving circuits, electromagnetics, materials, electron transport, and thermal diffusion in a broad band of frequencies. Experimentally, a rapid low-temperature process is critical to preserve the structural integrity of the Cu nanowires during deposition and will be studied. To conquer the aforementioned challenges, multiphysics simulation algorithms and experimental methods will be pursued. On the experimental side, a low temperature chemical vapor deposition recipe, along with a plasma enhanced process, will be developed. Electrical and thermal transport measurements will be performed and correlated with simulations.