ANODIC BONDING BETWEEN CERAMICS AND METAL, AND ITS ANALYSIS OF BONDING MECHANISM
ANODIC BONDING BETWEEN CERAMICS AND METAL, AND ITS ANALYSIS OF BONDING MECHANISM
批准号:
16560634
负责人:
SASAKI Gen
金额:
$2.37万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (C)
财政年份:
2004
资助国家:
日本
项目状态:
已结题
起止时间:
2004 至 2005
中文摘要
近年来,在低温连接方面,金属与陶瓷搭接后施加电位的阳极连接受到了广泛关注,但外加电位对连接界面微观结构和元素扩散的影响还不清楚。因此,阳极键合技术是否适用于传感器与执行器的组装技术还有待进一步研究。本研究的目的是阐明粘结条件对界面结构的影响,并研究其应用的可能性。为了了解电势对原子扩散的影响,首先在离子导体上蒸镀金属膜,然后估算电势条件对电流密度和微观结构的影响。本研究中使用的离子导体是硼硅酸盐玻璃和含钠的β氧化铝,阴极侧是玻璃和β氧化铝,阳极侧是铝片 ...更多信息 侧,分别。在523- 673 K温度范围内,对涂铝离子导体施加不同电位模式的电位,测量了涂铝玻璃和β-氧化铝中电流的变化。因此,在施加电压的次日,电流急剧增加,并出现最大值,然后逐渐减小。这一现象与钠离子在离子导体中的迁移率有定量关系。随着处理温度的升高,可动离子增多。但电流密度的增加量随温度的升高而减小.从电子探针分析和透射电镜观察结果来看,随着界面的靠近,钠元素的含量逐渐减少,这是钠的贫化层。该层显示使用传感器的恶性肿瘤。此外,铝元素在钠耗尽层中扩散。由于玻璃中钠的含量比β铝中高,所以β铝中钠离子的总电流和迁移量比玻璃中大。少
英文摘要
Anodic bonding by lapping metal to ceramics and then applying electric al potential has grate-watched recently on the point of low-temperature bonding, Unfortunately, the effect of applied potential on the microstructure around bonded interface and the diffusion of the elements has still unknown. So that, it has unknown that the anodic bonding is suitable for the assemble technique for sensor and actuator. The aim of this study is to clarify the effect of the bonding conditions on the interfacial structure and to research the possibility for the application use. At first, in order to understand the effect of electrical potential on the atomic diffusion, metal film was evaporated on the ionic conductor and then the effect of the condition of the electrical potential on current density and microstructure were estimated. Ionic conductors used in this study were boro-silicate glass and sodium containing beta alumina Cathode side was glass and beta alumina, and Anode side was aluminum file … More side, respectively. As electrical potential with several potential patterns applied to aluminum coated ionic conductor at 523-673K, the change of electric current in aluminum coated glass and beta alumina was measured. Therefore, the electric current increased dramatically on the morrow of applying potential and show the maximum point and then decreased gradually. This phenomena is related with the mobility of sodium ion in ionic conductor quantitatively. As increasing treatment temperature, movable ions increased. But the increment of current density obtund as increasing temperature. From result of EPMA analysis and TEM observation, the content of sodium element decreased as approaching bonded interface, which is sodium depletion layer. This layer shows malignancy for use the sensor. Furthermore, aluminum element diffused in sodium depletion layer. As the sodium contents in glass are more than that in beta aluminum, the total current and the movement of sodium ion in beta aluminum is more than that of glass. Less
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Anodic Bonding and, its Interfacial Reaction between Metals and Ionic Conductor
阳极键合及其金属与离子导体之间的界面反应
DOI:
--
发表时间:
2006
期刊:
Proc.of 2nd JSME/ASME International Conference on Materials and Processing 2005 (CD-ROM)
影响因子:
--
作者:
[G.Sasaki, K.Mastugi, O.Yanagisawa]
通讯作者:
O.Yanagisawa
Anodic Bonding and its interfacial reaction of metals and ionic conductor
金属与离子导体的阳极键合及其界面反应
DOI:
--
发表时间:
2004
期刊:
Proc.of annual meeting for Japan institute of metals, chugoku, and shikoku branch. 12
影响因子:
--
作者:
[G.Sasaki, K.Matsugi, O.Yanagisawa]
通讯作者:
O.Yanagisawa
イオン伝導体/金属界面の電圧印加の影響
施加电压对离子导体/金属界面的影响
DOI:
--
发表时间:
2006
期刊:
日本金属学会中国四国支部鉄鋼47回金属第44回講演大会概要
影响因子:
--
作者:
[佐々木元, 亀島純一, 松木一弘, 柳澤平]
通讯作者:
柳澤平
Effect of applied potential on interface between ionic conductor and metal.
施加电势对离子导体和金属之间界面的影响。
DOI:
--
发表时间:
2005
期刊:
Proc.of annual meeting for Japan institute of metals, chugoku, and shikoku branch. 27
影响因子:
--
作者:
[H.Oka, G.Sasaki, K.Matsugi, O.Yanagisawa]
通讯作者:
O.Yanagisawa
Anodic Bonding of metals and ionic conductor ceramics.
金属和离子导体陶瓷的阳极键合。
DOI:
--
发表时间:
2004
期刊:
Proc.of 12^<th> M&P
影响因子:
--
作者:
[G.Sasaki, Y.-B.Choi, K.Matsugi, O.Yanagisawa]
通讯作者:
O.Yanagisawa
共 8 条
Development of manufacturing process for multi-functional metal matrix composites with high shape flexibility
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批准号:21560771
-
项目类别:Grant-in-Aid for Scientific Research (C)
-
资助金额:$3.08万
-
财政年份:2009
-
负责人:SASAKI Gen
-
依托单位:
Microscopic analysis of deformation and fracture of metal matrix composites
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批准号:09650749
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项目类别:Grant-in-Aid for Scientific Research (C)
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资助金额:$2.3万
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财政年份:1997
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负责人:SASAKI Gen
-
依托单位:
海外基金