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Elektronenstrahl-Lithographie-System

Elektronenstrahl-Lithographie-System
电子束光刻系统
批准号:
525501813
负责人:
金额:
$0.0万
依托单位国家:
德国
项目类别:
Major Research Instrumentation
财政年份:
2023
资助国家:
德国
项目状态:
未结题
起止时间:
2022-12-31 至 --

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中文摘要
翻译
为了制造超高分辨率的混合系统,需要获得一种能够实现平面和三维纳米结构的精密纳米加工系统。该系统由电子束光刻设备(EBL)和三维微细加工设备(3DMF)组成,将在W.Perice被任命为海德堡大学的背景下申请,并将确保该小组的工作熟练程度,以及作为纳米和量子技术领域新研究活动的核心。精密纳米制造系统将用于实现大面积的光子、电子和混合纳米结构。平面器件将使用EBL进行光刻制造,通过高时钟频率实现复杂的晶圆级芯片系统。在芯片系统中,变化超过几个数量级的纳米和微结构将被结合,局部尺寸小于10 nm的纳米结构嵌入在大的EBL写入场中。对于来自不同工作组的多个用户的系统操作,快速时钟周期应支持较短的写入时间。通过与EBL制造的标记结构进行精确对准,3DMF将使尺寸远低于一微米的自由形状设备能够进入第三维度。具有多个独立组件的芯片系统混合集成的关键是高度并行化,这将通过高表面质量的3D激光光刻和灰度光刻实现。2D和3D纳米结构的精密制造方法的组合将基于Perice集团使用的光子计算机辅助设计(PCAD)的概念,该概念允许在通用布局语言中灵活地结合这两种制造方法。精密纳米制造系统将嵌入海德堡大学现有的纳米制造基础设施中。基尔霍夫物理研究所(KIP)、欧洲神经形态计算研究所(EINC)、分子系统工程与先进材料研究所(IMSEAM)和计算机工程研究所(ZITI)可用的纳米制造资源也将由邻近的物理与结构研究所和3DMM2O卓越集群的研究小组联合使用。因此,新的基础设施将向广泛的用户提供,并将不断扩大。该系统将作为多用户设备运行,并决定性地加强海德堡大学精密纳米制造的可能性。
英文摘要
For the fabrication of ultra-high resolution hybrid systems, a precision nanofabrication system is to be procured which allows the realization of planar and three-dimensional nanostructures. The system, consisting of a device for electron beam lithography (EBL) combined with a device for 3D microfabrication (3DMF), will be applied for in the context of W. Pernice's appointment at the University of Heidelberg and will ensure the working proficiency of the group as well as serve as a nucleation point for new research activities in the field of nano- and quantum technology. The precision nanomanufacturing system will be used to realize large-area photonic, electronic and hybrid nanostructures. Planar devices will be lithographically fabricated using EBL, enabling complex wafer-level chip systems via a high clock rate. Within the chip systems, nano- and microstructures with variations over several orders of magnitude are to be combined, with nanostructures with local dimensions below 10 nm embedded within large EBL write fields. For system operation with many users from different workgroups, a fast clock cycle shall enable short write times. Via precision alignment against EBL-manufactured marker structures, 3DMF will enable access to the third dimension, for free-form devices with dimensions well below one micrometer. Crucial for the hybrid integration of chip systems with many individual components is a high degree of parallelization, which will be achieved via 3D laser lithography and grayscale lithography with high surface quality. The combination of the precision manufacturing approaches for 2D and 3D nanostructures will be based on the concept for Photonic Computer Aided Design (PCAD) used in the Pernice group, which allows to flexibly combine both manufacturing methods in a common layout language. The precision nanomanufacturing system will be embedded in the existing infrastructure for nanomanufacturing at Heidelberg University. The nanomanufacturing resources available at the Kirchhoff Institute of Physics (KIP), the European Institute for Neuromorphic Computing (EINC), the Institute for Molecular Systems Engineering and Advanced Materials (IMSEAM) and the Institute of Computer Engineering (ZITI) will also be used jointly by research groups from the neighboring Institute of Physics and the STRUCTURES and 3DMM2O clusters of excellence. Thus, the new infrastructure will be available to a wide range of users, which will be continuously expanded. The system will be operated as a multi-user device and decisively strengthen the possibilities for precision nanomanufacturing at Heidelberg University.
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