Dynamic Scaling Study of Thin Films in electrodeposition Growth Using AFM

(1)电沉积中的三维生长我们用原子力显微镜研究了脉冲电沉积镍表面的结垢特性。表面生长表现出异常的动力学标度行为，其特征在于局部粗糙度指数ε_<loc>，全局标度指数ε_和动力学指数z，对于中间时间制度I^z &lt; L^z，其中I和L表示窗口长度和系统尺寸。镍表面的局部界面宽度导致η <loc>=1.0，全局标度指数η =2.8和动力学指数z=4.1。所有的实验数据都在反常标度函数的曲线图上崩溃。(2)电沉积中的二维生长用原子力显微镜研究了（100）Ni基片上电沉积Ni薄膜的表面生长。在生长的早期阶段，在（100）Ni衬底上成核的岛，其横截面看起来是矩形的，以相同的晶体学取向横向生长。生长表面显示出正常的缩放行为，其特征在于由线性表面扩散普适性类。沿着时间演化，生长出现不稳定性，观察到从二维生长到三维生长的转变。在这一阶段，表面生长服从异常标度，其特征在于局部粗糙度指数<loc>=1.0，整体标度指数=2.1和动力学指数z=1.0。

(1) Three-dimensional growth in electrodepositionWe have made investigation into scaling properties of nickel surfaces grown by pulse-current electrodeposition using atomic force microscopy. The surface growth exhibits an anomalous dynamic scaling behavior characterized by a local roughness exponent ζ_<loc>, global scaling exponent ζ and dynamic exponent z for an intermediate time regime I^z < L^z where I and L denote a window length and system size. The local interface width of the nickel surfaces leads to ζ_<loc>=1.0, global scaling exponent ζ=2.8 and dynamic exponent z=4.1. All the experimental data collapse on a plot of the anomalous scaling function.(2) Two-dimensional growth in electrodepositionSurface growth of Ni thin films electrodeposited on (100) Ni substrates has been investigated using atomic force microscopy. In the early stage of growth, islands nucleated on the (100) Ni substrates, which appear to be rectangular in cross section, grow laterally in the same crystallographic orientation. Growth surfaces are shown to display a normal scaling behavior characterized by the linear surface diffusion universality class. Along the time evolution, instability in growth occurs and a transition from two-dimensional growth to three-dimensional growth is observed. In this stage, surface growth obeys anomalous scaling characterized by a local roughness exponent ζ_<loc>=1.0, global scaling exponent ζ=2.1 and dynamic exponent z=1.0.