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Control of Interfacial Reaction in the Dissimilar Joints Using Shape Memory Alloy Thin Wires for the Fabrication of Medical Devices Inserted in Blood Vessel

Control of Interfacial Reaction in the Dissimilar Joints Using Shape Memory Alloy Thin Wires for the Fabrication of Medical Devices Inserted in Blood Vessel
使用形状记忆合金细线控制异种接头中的界面反应来制造插入血管的医疗器械
批准号:
14550703
负责人:
UENISHI Keisuke
金额:
$2.3万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (C)
财政年份:
2002
资助国家:
日本
项目状态:
已结题
起止时间:
2002 至 2003

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中文摘要
翻译
为探讨激光微细焊接技术在医疗器械制造中的应用,采用激光微点熔法对钛镍基形状记忆合金生物材料焊丝进行了微点熔化处理,通过优化激光功率或脉冲宽度等激光条件,获得了无缺陷的声点熔化焊丝,使直径为0.15 mm的焊丝熔化宽度减小到0.2 mm左右。与5U5304线材相比,形状记忆合金线材的熔化需要更精确的激光条件控制,但需要的功率较小,熔化后的金属呈现快冷组织。与母材相比,点熔焊丝的抗拉强度达到70%,超弹性行为基本相同。此外,浸泡试验和阳极极化曲线的测量证实,激光点焊NT-E4焊丝在准生物环境中仍能保持良好的耐腐蚀性,激光点焊焊丝也成功地制备出交叉或平行接头,表明激光微细焊接适用于生物医学器件的制造。
英文摘要
In order to investigate the applicability of laser micro welding to the fabrication of medical devices, Ti-Ni based shape memory alloy biomaterials wires were micro spot melted by using YAG laser.By the optimization of laser conditions such as laser power or pulse duration, sound spot melted wires free from any defects were prepared and the width of the melted metal was reduced to about 0.2mm for the 0.15mm diameter wires. Compared with the 5U5304 wires, melting of shape memory alloy wires needed more precise control of laser conditions although it needed smaller power input.Melted metal exhibited a rapidly quenched microstructure. The spot melted wires showed 70% of tensile strength and almost the same super-elastic behavior compared with base materials. Besides, it was confirmed by immersion test and by measurement of anodic polarization curve that NT-E4 wires still retain a sound corrosion resistance in a quasi biological environment by laser spot melting.Crosswise or parallel joints was also successfully prepared by laser spot welding of wires, suggesting the laser micro welding is applicable to the fabrication of biomedical devices.
期刊论文(14)
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会议论文
Masaya Takatugu: "Nd-YAG Lase Micro Welding of Stainless Wire"Proceedings of the International Welding and Joining Conference.-Korea 2002. 187-192 (2002)
Masaya Takatugu:“不锈钢丝的 Nd-YAG 激光微焊接”国际焊接和连接会议论文集。-韩国 2002 年。187-192 (2002)
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上西 啓介: "Ag-Cu系ろう材を用いたTi-Ni系形状記憶合金とステンレス鋼の異材接合"ぶれいず. Vol.37 No.108. 29-35 (2003)
Keisuke Uenishi:“使用 Ag-Cu 钎料金属连接 Ti-Ni 形状记忆合金和不锈钢”Breeze,第 37 卷第 29-35 期。
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通讯作者:
Masaya Takatsugu: "Nd-YAG Lase Micro Welding of Stainless Wire"Proc of the Inter.Welding and Joining Conf.-Korea 2002,Oct.28-30,Gyeongju Korea. 187-192 (2002)
Masaya Takatsugu:“不锈钢丝的 Nd-YAG 激光微焊接”Proc of the Inter.Welding and Joining Conf.-Korea 2002,10 月 28-30 日,韩国庆州。
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通讯作者:
Yasuhito Ogata: "Tensile Strength and Pseudo-elasticity of YAG Laser Spot Melted Ti-Ni Shape Memory Alloy Wires"Materials Transactions. Vol.45. 1070-1076 (2004)
Yasuhito Ogata:“YAG 激光点熔钛镍形状记忆合金丝的拉伸强度和伪弹性”材料交易。
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共 12 条
    Investugation of Electro-migration Behavior in Solder Joints
    • 批准号:
      22560722
    • 项目类别:
      Grant-in-Aid for Scientific Research (C)
    • 资助金额:
      $2.5万
    • 财政年份:
      2010
    • 负责人:
      UENISHI Keisuke
    • 依托单位:
    Effect of Third Element Addition on Eutectic Microstructure of Lead Free Low Temperature Sn-Bi Based Solders
    • 批准号:
      19560728
    • 项目类别:
      Grant-in-Aid for Scientific Research (C)
    • 资助金额:
      $3.0万
    • 财政年份:
      2007
    • 负责人:
      UENISHI Keisuke
    • 依托单位:
    Dvelopment of Sn-Bi Based Low Temperature Solders which Enables Step Soldering
    • 批准号:
      17560633
    • 项目类别:
      Grant-in-Aid for Scientific Research (C)
    • 资助金额:
      $2.3万
    • 财政年份:
      2005
    • 负责人:
      UENISHI Keisuke
    • 依托单位:
    海外基金