A 3 Dimensional Integration Scheme Utilizing Wireless Interconnections for Implementing Hyper Brains

研究目标：基于无线互联和目标识别系统的三维集成技术研究成果：(1)。芯片到芯片无线互连和3D集成器件提出了利用耦合电感之间的电磁感应实现芯片到芯片的无线互连，并设计和制作了测试电路。采用1 mW的功耗实现了1 Gb/S的码率，采用高速设计实现了2.4 Gb/S的码率，提出了基于片上天线和电感耦合互连的无线三维集成技术--3DCS。设计并制作了基本方案和原型系统。利用3DCSSS实现了高性能的图像处理。提出了电感端接和耦合的驻波振荡器，并采用0.18um工艺设计并制作了测试芯片。获得了10 GHz的低相噪高质量振荡信号。MOS器件MOD…提出了更多的基于表面电势的EL(HiSIM)，对于频率范围大于10 GHz的射频电路应用，具有较少参数的高精度描述能力。(2)采用芯片到芯片无线互连的高认知系统开发了一种采用模拟和数字组合电路技术的联想存储器，证实了该系统具有低功耗、高速运行的特点。利用联想存储器实现了图像信号中目标检测、跟踪和识别所必需的高功能、高性能的模式匹配，并实现了集成3种图像处理芯片的3D原型系统，获得了预期的数据传输速度。实现脑功能和系统的处理算法和系统在联想存储器中实现了基于人脑的学习算法。利用该算法，提出了一种基于记忆的学习模型，并验证了其在图像识别中的有效性。较少

Research Objectives:3D integration technologies using wireless interconnections and object recognition systems Research achievements:(1). Chip-to-chip wireless interconnection and 3D integration deviceschip-to-chip wireless interconnection using electromagnetic induction between coupled inductors was proposed, and test circuits were designed and fabricated. Bit rate of 1Gb/s was achieved with 1mW power dissipation; Bit rate of 2.4Gb/s was achieved with high speed design.Three dimensional integration technology utilizing wireless interconnection using on-chip antenna and inductor coupled interconnection, named 3DCSS was proposed. Basic scheme and prototype systems were designed and fabricated. High performance image processing was realized with 3DCSS.Standing wave oscillator using inductor termination and coupling was proposed and a test chip was designed and fabricated with an 0.18um CMOS technology. 10GHz high quality oscillation signal with low phase noise was obtained.MOS device mod … More el (HiSIM) using surface potential was proposed, and highly accurate description capability with small number of parameters was effective for larger than 10GHz frequency range RF circuit applications.(2) Highly cognitive systems using chip-to-chip wireless interconnectionAn associative memory using analog and digital combined circuit techniques was developed, and highly speed operation with low power dissipation were confirmed. Highly functional, high performance pattern matching which was essential for detection, tracking and recognition of objects in image signals was implemented utilizing the associative memories.3D prototype system integrating three kinds of image processing chips was implemented, and expected data transfer speed was obtained. Low voltage operated low noise amplifier and high performance VCO were also developed for basic circuit blocks.(3) Processing algorithm for implementing brain functions and systemsLearning algorithm based on a human brain was implemented in an associative memory. By using the algorithm, a memory based learning model was proposed and its effectiveness for image recognition was confirmed. Less