CHRONIC TRANSCRANIAL ELECTRICAL CONNECTOR

本提案中描述的设备解决了高密度经皮馈通和神经假体植入式电连接器的需求。目标是开发一种慢性系统，用于经颅传递高密度多通道电极阵列植入哺乳动物感觉和运动皮层的信号。在第一阶段，开发并演示了一种密封多层陶瓷封装，能够安装在头骨顶部以容纳VLSI电路。第二阶段将对封装进行微小的设计更改，并将金属法兰和钎焊转换为生物相容性材料，如钛和金钎焊。将开发一种聚酰胺和/或聚对二甲苯微带电缆（间距25微米，厚度15微米）以及将其粘接到微电极阵列背面和陶瓷封装底部的方法。将设计和制造具有多达100通道预放大、高速多路复用器和A/D转换器的VLSI芯片。阵列、微带电缆、陶瓷封装和VLSI芯片的最终组装将在体外和体内进行测试（猫听觉皮层约3个月）。建议的商业应用：慢性经颅电连接器将销售给神经科学研究人员，使他们能够在哺乳动物大脑并行处理的慢性研究中使用多电极阵列。这种陶瓷还将为他们提供一个平台，在这个平台上开发人类神经假肢的电路。

The device described in this proposal addresses the need identified for high-density percutaneous feedthroughs and implantable electrical connectors for neural prosthesis. The goal is to develop a chronic system for the transcranial delivery of signals from high density, multichannel electrode arrays implanted in mammalian sensory and motor cortexes. In Phase I, a hermetic multi-layer ceramic package, capable of being mounted on top of the skull to house VLSI circuitry, was developed and demonstrated. Phase II will make minor design changes to the package and convert the metal flanges and braze to biocompatible materials such as titanium and gold braze. A polymide and/or Parylene microribbon cable (25 mum spacing, 15 mum thick) and a method of bonding it to the back of the microelectrode array and to the base of the ceramic package will be developed. A VLSI chip will be designed and manufactured that has up to 100 channels of pre-amplification, a high speed multiplexer, and an A/D converter. The final assembly of array, microribbon cable, ceramic package and VLSI chip will be tested in vitro and in vivo (cat auditory cortex for about three months). PROPOSED COMMERCIAL APPLICATION: The chronic transcranial electrical connector will be marketed to neuroscience researchers to enable them to use multielectrode arrays in chronic investigators of the parallel processing of the mammalian brain. The ceramic will also provide them with a platform on which to develop circuitry for human neuroprosthetics.