Silicon pixel detectors for Synchrotron beam lines

该项目旨在以格拉斯哥大学和钻石探测器开发小组的现有工作为基础，研究适用于钻石同步加速器的新型硅像素探测器架构。该学生将在格拉斯哥探测器开发小组与Richard Bates博士（RD50合作中的3D探测器小组负责人）和Andrew Blue博士（APS传感器测试专家）一起工作，在钻石探测器小组与Nicola Tartoni博士（钻石探测器小组负责人）和Julien Marchal博士（探测器专家，特别负责组织该项目中的测试束活动）一起工作。指导学术人员将是克里斯·帕克斯博士（格拉斯哥RD50活动负责人）。将研究两种技术：1)用于10- 20kev x射线束流线的小尺寸混合像素器件，减少电荷共享；2)用于软x射线衍射的有源像素传感器，以及高能束流线的实时应用。学生将主要集中在探测器测试和表征，在格拉斯哥实验室和钻石光束线。将执行设备建模以支持对结果的分析。根据项目需要，学生将在格拉斯哥大学学习一部分时间，在钻石同步加速器学习一部分时间。该学生将在格拉斯哥大学进行相关的博士培训课程。1)混合像素设备目前现有的商用混合像素设备基于170x170微米像素（在Diamond使用的最先进的皮拉图斯系统中）。在Diamond，对更小像素尺寸的硅传感器的需求已经被清楚地识别出来。格拉斯哥大学和戴蒙德大学都是Medipix合作项目的成员，该项目生产单光子计数55x55微米像素读出前端电子产品。然而，传统的小像素平面器件在像素之间存在电荷共享问题。这可以通过使用3D传感器来限制电荷共享或电子读出芯片（或两者兼而有之）来解决。3D传感器：这项工作建立在以前非常成功的CASE学生的基础上，这导致了一种新型3D探测器架构传感器和同步加速器应用的第一个3D探测器的设计，模拟和首次生产。这些测试表明，电荷共享显著减少。3D制造技术（适用于3D探测器或平面探测器）可以产生无边缘设备，允许在一个区域上平铺设备，显然应用于钻石成像，并将在未来的生产中考虑。读出芯片：Medipix3读出芯片即将上市，它将尝试通过电子电路减少电荷共享。传统设备（以及3D设备）的电荷共享将与Medipix2进行比较。主动像素传感器（APS）与同步加速器应用中传统使用的CCD器件相比，具有关键优势，这是因为APS的像素内电子器件可针对所需应用进行配置。在Diamond，这在软x射线衍射光束线（I10, I06）上有潜在的应用，加上一个闪烁体，在高能光束线（I15和I12）上也有潜在的应用。适用于同步加速器应用的大面积设备是由APS技术生产的，APS传感器可以以高帧率读取。格拉斯哥大学小组，作为MI3的一部分，已经开发了APS传感器特性的设置和技术。近年来，这已应用于4种尺寸从45微米到6微米的APS传感器的表征。适用于Diamond的APS传感器已经存在，并将在本CASE研究项目的早期阶段进行测试。这项初步研究可能会产生（额外的拨款申请）建议，以生产适合Diamond应用的大面积低噪声APS传感器。

The project aims to build on existing work in the University of Glasgow and Diamond detector development group to investigate novel silicon pixel detector architectures applicable to use at the Diamond Synchrotron. The student will work in the Glasgow detector development group with Dr Richard Bates (head of 3D detector group in the RD50 collaboration) and Dr Andrew Blue (expert on APS sensor testing), and in the Diamond Detector group with Dr Nicola Tartoni (head of Diamond detector group) and Dr Julien Marchal (detector expert with particular responsibility for organising testbeam activities in this project). The supervising academic staff member will be Dr Chris Parkes (head of Glasgow RD50 activities). Two technologies will be investigated: 1) Small dimension hybrid pixel devices with reduced charge sharing for use on 10-20 KeV X-ray beam lines 2) Active pixel sensors for soft x-ray diffraction, and high energy beam line real-time applications. The student will primarily concentrate on detector testing and characterisation, both in the Glasgow laboratory and on Diamond beamlines. Device modeling will be performed to underpin the analysis of the results. The student will spend part of their time at the University of Glasgow and part at the Diamond Synchrotron, depending on the project needs. The student will undertake the relevant PhD training courses at the University of Glasgow. 1) Hybrid Pixel Devices Currently existing commercial hybrid pixel devices are based on 170x170 micron pixels (in the state-of-the-art Pilatus system used at Diamond). At Diamond the needs for smaller pixel size silicon sensors have been clearly identified. Both the University of Glasgow and Diamond are members of the Medipix collaboration which produces single photon counting 55x55 micron pixel readout front-end electronics. However, conventional small pixel planar devices suffer from charge sharing between pixels. This can be addressed through either the use of 3D sensors to limit charge sharing or in the electronic read-out chip (or both). 3D sensors: This work builds on the highly successful previous CASE studentship which resulted in the design, simulation and first production of a novel 3D detector architecture sensor and the first 3D detector for synchrotron applications. These tests have demonstrated significantly reduced charge sharing. 3D fabrication techniques (applied to either 3D detectors or planar detectors) can yield edgeless devices which allow tiling of devices over an area, of obvious application to imaging at Diamond, and will be considered in a future production. Read-out Chip: The Medipix3 readout chip will soon be available which will attempt to reduce charge sharing through the electronic circuitry. The charge sharing in a conventional (as well as 3D) device will be compared against Medipix2. 2) APS Development Active pixel sensors (APS) have the key advantage over CCD devices that are conventionally used in Synchrotron applications, which is that the APS in-pixel electronics is configurable for the required application. At Diamond this has potential applications on soft X-ray diffraction beamlines (I10, I06) and, coupled with a scintillator, on High Energy beamlines (I15 and I12). Large area devices suitable for Synchrotron applications are producible from APS technology, and APS sensors can be readout with a high frame rate The University of Glasgow group, as part of MI3, has developed a setup and techniques for the characterisation of APS sensors. In recent years this has been applied to the characterisation of 4 types of APS sensor with dimensions from 45 micron down to 6 micron. APS sensors suitable for application at Diamond are already extant and will be tested in the early part of this CASE studentship. This initial study is likely to result (with additional grant applications) in suggestions to produce large area low noise APS sensors ideally tailored to Diamond applications.