Detector development for future particle detectors with a focus on new technologies for the ATLAS experiment at the LHC

该项目解决了目前高能物理实验中的一个挑战：在空间和时间上的精确检测或4D跟踪。欧洲核子研究中心大型强子对撞机上的所有实验都将对其系统进行升级，以应对本十年后五年增加的束流光度。事件数量的增加将允许进行更大的统计，从而更有可能发现新的现象。然而，更多的事件也将意味着整个探测器系统的更大重叠和辐射损害的增加，特别是在更接近相互作用点的区域。曼彻斯特集团率先开发和利用3D硅传感器，目前安装在ATLAS可插入B层(IBL)中，并计划在2027年升级为Layer0。3D传感器是用微电子机械系统(MEMS)技术制造的，在硅体内部使用p电极和n电极进行加工。这种几何结构已被证明特别适合于耐辐射和快速信号响应。人们正在研究将沟槽电极与新一代前端电子芯片相结合的3D几何结构的演变，以提供所需的空间和时间精度(&lt；10微米和&lt；10皮秒)，以及必要的辐射容忍度&gt；2x1016 Ncm-2，以满足2027年后可能的升级。该项目的主要目标是：-使用传统的3D硅传感器进行精确跟踪，并将其凸点连接到TimepeX3读出电子芯片上。TimepeX3读取器的像素尺寸为55x55微米的平方，响应速度为2 ns，具有到达时间(TOA)功能。-使用传统的3D硅传感器进行精确跟踪，并将传统的3D硅传感器凸点连接到Timeix4读出电子芯片上。TIMEPEPIX4读取器的像素尺寸为55x55微米的平方，响应速度为200ps，可用于凸点焊接。-使用带有沟槽电极和专用读出电子设备的3D硅进行精确跟踪。具有沟槽电极的3D已经制造出来，初步测试非常令人鼓舞。用单通道读出电子器件进行的测试表明，响应速度为~6 ps

The project addresses one of the current challenges in high energy physics experiments: precision detection in both space and time or 4D tracking. All experiments at the CERN Large Hadron Collider will undergo upgrades in their systems to cope with the increased beam luminosities in the second half of this decade. The increased number of events will allow a larger statistic, with a consequent better probability of discoveries of new phenomena. The larger number of events, however, will also imply a larger overlap and an increase in radiation damage of the full detector system, in particular in the region closer to the interaction point. The Manchester group has pioneered the development and exploitation of 3D silicon sensors, which are now installed in the ATLAS Insertable B-Layer (IBL) and are planned for the upgraded Layer0 in 2027. 3D sensors, fabricated using Micro-Electro-Mechanical System (MEMS) technology, are processed with p- and n- electrodes inside the silicon bulk. This geometry has shown to be particularly suited for radiation tolerance and fast signal response. An evolution of the 3D geometry with trench electrodes combined with a new generation of front-end electronics chips are being studied to provide the required precision in space and time (<10 microns and <10 picoseconds) together with the necessary radiation tolerance >2x1016 ncm-2 for possible upgrades beyond 2027. The main objectives of the project are: - Precision tracking using traditional 3D silicon sensors bump-bonded to the Timepix3 readout electronics chip. The Timepix3 readout has a pixel size of 55x55 microns squared, a response of 2ns and Time of Arrival (ToA) functionality.- Precision tracking using traditional 3D silicon sensors bump-bonded to the Timepix4 readout electronics chip. The Timepix4 readout has a pixel size of 55x55 microns squared, a response of 200ps and is becoming available for bump bonding.- Precision tracking using 3D silicon with trench-electrodes and a dedicated readout electronics. 3D with trench electrodes have been fabricated and preliminary tests are very encouraging. Tests with single channel readout electronics have shown a response of ~6 ps