Universal chip-chip bonder

配备有微传感器或微电极的微流体装置和细胞培养平台通常由两个芯片制成，这两个芯片都是微结构化的。通常，微流体部件在顶板上图案化，而微传感器或微电极在底板上结构化。所要求的通用芯片-芯片焊接机将允许这些器件的精确对准和焊接。芯片的尺寸范围为3 x 3 mm至20 x 20 mm。可以采用以下类型的粘合：阳极粘合、PDMS玻璃密封、热熔粘合和胶合。

Microfluidic devices and cell culture platforms equipped with microsensors or microelectrodes are often made of two chips both of which are microstructured. Typically, a microfluidic component is patterned on the top plate, whereas microsensors or microelectrodes are structured on the bottom plate. The requested universal chip-chip bonder will allow the accurate alignment and the bonding of these devices. The dimensions of the chips will range from 3 x 3 mm to 20 x 20 mm. The following types of bonding will be possible: anodic bonding, PDMS-glass sealing, thermofusion bonding and gluing.