Surface and materials electrochemistry: adsorption, reduction, oxidation, and corrosion phenomena

能力和方法。我提出的实验和理论研究的前手性/手性有机分子的吸附在非手性/手性Pt（hkl）电极，其电催化氢化（ECH）的机制和动力学。我将进行T依赖性研究，并将确定氢（H），阴离子（AN）和有机分子（ORG）的表面覆盖率。我将确定H和ORG吸附的热力学状态函数。ECH的产品，它们的产量，和对映体过量将使用气相色谱，核磁共振，和圆二色性检查。我将研究Ag和Cu在Pt（hkl）、Au（hkl）和Rh（hkl）电极上的欠电位沉积（UPD）。Ag和Cu的表面覆盖率将通过电化学技术的应用来检查。我将进行依赖于T的循环伏安法（CV）的研究，并进行理论数据分析，以确定基板吸附键能。分析了电化学界面对金属界面结合的影响。本文将研究钛钼合金（TMA）和镍钛合金（NiTi）表面彩色钝化层在模拟体液中的生物腐蚀性和生物相容性。我还将研究吸附模型蛋白质对这些材料使用互补的物理和分析技术。

OBJECTIVES AND APPROACH. I propose experimental and theoretical studies on the adsorption of prochiral/chiral organic molecules on achiral/chiral Pt(hkl) electrodes, and the mechanism and kinetics of their electrocatalytic hydrogenation (ECH). I will perform T-dependent studies and will determine the surface coverage of hydrogen (H), anions (AN), and organic molecules (ORG). I will determine thermodynamic state functions for H and ORG adsorption. The products of ECH, their yields, and enantiomeric excesses will be examined using vapor-phase chromatography, nuclear magnetic resonance, and circular dichromism. I will investigate the under-potential deposition (UPD) of Ag and Cu on Pt(hkl), Au(hkl) and Rh(hkl) electrodes. The surface coverage of Ag and Cu will be examined by application of electrochemical techniques. I will conduct T-dependent cyclic-voltammetry (CV) studies and perform theoretical data analysis to determine the substrate-adsorbate bond energy. I will analyze the influence of electrochemical interface on the interfacial bonding of metals. I will investigate the biocorrosion and biocompatibility of colored passive layers on titanium-molybdenum alloy (TMA) and nickel-titanium alloy (NiTi) in simulated body fluids. I will also study the adsorption of model proteins on these materials using complementary physical and analytical techniques.