Design automation algorithms of integrated circuits and microsystems

随着技术的快速进步、系统的复杂性和信号速度的提高，人们对电子设计自动化(EDA)工具提出了巨大的要求，以提供同样的效率和精度。制造工艺技术的创新显著减小了集成电路的特征尺寸，提高了芯片的封装密度。激进的设计目标，如片上系统或封装中的系统，加上工作频率的增加，需要多学科的设计方法，如电气、热和电磁分析，以准确地对高速集成电路进行建模。此外，工艺技术的进步引入了新型的集成传感器和执行器，通常被称为微电子机械系统(MEMS)。MEMS的设计需要多方面的工程原理知识，如电子学、力学、光学、热学和流体。由于这些技术的进步，传统EDA工具的基本算法已经变得无效，在某些情况下已经过时，无法解决现代设计的多学科性质和计算复杂性。

With rapid advances in technology, system complexity and increased signal speeds, significant demands are placed on Electronic Design Automation (EDA) tools to provide the same efficiency and accuracy. Innovations in fabrication process technology have significantly reduced the feature sizes of integrated circuits and increased packing densities of chips. Aggressive design objectives such as system on chip or system in package coupled with increased operating frequencies require multidisciplinary design methodologies such as electrical, thermal and electromagnetic analysis to accurately model high-speed integrated circuits. Furthermore, advances in process technology have introduced novel integrated sensors and actuators, popularly referred to as the micro-electromechanical systems (MEMS). The design of MEMS requires knowledge of multiple engineering principals such as electronics, mechanics, optical, thermal and fluids. As a result of these technological advancements, the underlying algorithms of traditional EDA tools have become ineffective and in some cases obsolete in addressing the multidisciplinary nature and computational complexity of modern designs.