Design automation algorithms of integrated circuits and microsystems

随着技术、系统复杂性和信号速度的快速发展，对电子设计自动化（EDA）工具提出了很高的要求，以提供相同的效率和精度。制造工艺技术的创新已经显著地减小了集成电路的特征尺寸并且增加了芯片的封装密度。诸如片上系统或封装中系统等激进的设计目标加上增加的工作频率，需要多学科的设计方法，例如电气、热和电磁分析，以准确地对高速集成电路进行建模。此外，工艺技术的进步已经引入了新颖的集成传感器和致动器，通常被称为微机电系统（MEMS）。MEMS的设计需要多个工程原理的知识，如电子，机械，光学，热和流体。由于这些技术的进步，传统EDA工具的底层算法在解决现代设计的多学科性质和计算复杂性方面变得无效，在某些情况下已经过时。

With rapid advances in technology, system complexity and increased signal speeds, significant demands are placed on Electronic Design Automation (EDA) tools to provide the same efficiency and accuracy. Innovations in fabrication process technology have significantly reduced the feature sizes of integrated circuits and increased packing densities of chips. Aggressive design objectives such as system on chip or system in package coupled with increased operating frequencies require multidisciplinary design methodologies such as electrical, thermal and electromagnetic analysis to accurately model high-speed integrated circuits. Furthermore, advances in process technology have introduced novel integrated sensors and actuators, popularly referred to as the micro-electromechanical systems (MEMS). The design of MEMS requires knowledge of multiple engineering principals such as electronics, mechanics, optical, thermal and fluids. As a result of these technological advancements, the underlying algorithms of traditional EDA tools have become ineffective and in some cases obsolete in addressing the multidisciplinary nature and computational complexity of modern designs.