GRAPPAS: Glass preforms rolled and Planarised for Photonics Applications in sandwich structures form

平面平台是光子学集成的基础部件。它还与LSI电子学兼容，将电子学、光子学、信号处理和超高速结合在一起，为未来所有光学集成电路的发展带来了巨大的希望。光纤也一直是实现高速通信的主干，但仍然是一个单一的管道，通过它，波长、时间或空间多路复用允许增强功能。最近，多芯光纤允许进一步集成，作为光纤基本平台的覆盖层。不幸的是，光纤确实与平面集成电路不兼容。该建议解决了这一特定问题，以允许以光带的形式实现灵活的光学电路集成和互连的面向未来的解决方案。这种光学带将使用传统的光纤制造技术来制造，从而实现了制造问题的经济有效的解决方案。光带将允许集成在激光的帮助下写入的功能设备，并与光纤和平面集成光学平台直接兼容。

The planar platform is a fundamental component in photonics integration. It is also compatible with LSI electronics and holds great promise for the future development of all optical integrated circuits, combining electronics, photonics, signal processing and ultra-high speeds. The optical fibre has also been the backbone for enabling high speed communications, but remains a single pipe through which wavelength, time or spatial multiplexing allows enhanced functionality. Lately, multi-core fibres are allowing further integration as an overlay to the basic platform of the fibre. Unfortunately, the optical fibre is really not compatible with planar integrated circuits. This proposal address this specific problem to allow a future-proof solution to flexible optical circuit integration and interconnects in the form of an optical tape. This optical tape will be fabricated using traditional techniques for optical fibre manufacturing, allowing a cost-effective solution to the problem of fabrication. The optical tape will allow the integration of functionalised devices written with the help of lasers and be directly compatible with optical fibres and planar integrated optical platforms.