GRAPPAS: Glass preforms rolled and Planarised for Photonics Applications in sandwich structures form

平面平台是光子学集成中的基本部件。它还与LSI电子产品兼容，并为全光学集成电路的未来发展带来了巨大的希望，将电子学，光子学，信号处理和超高速结合在一起。光纤也一直是实现高速通信的骨干，但仍然是一个单一的管道，通过它，波长，时间或空间复用允许增强的功能。最近，多芯光纤允许进一步集成，作为对光纤基本平台的覆盖。不幸的是，光纤确实与平面集成电路不兼容。该提议解决了该特定问题，以允许以光带的形式对柔性光电路集成和互连提供面向未来的解决方案。这种光带将使用传统的光纤制造技术制造，从而为制造问题提供具有成本效益的解决方案。光带将允许集成在激光帮助下写入的功能化设备，并直接与光纤和平面集成光学平台兼容。

The planar platform is a fundamental component in photonics integration. It is also compatible with LSI electronics and holds great promise for the future development of all optical integrated circuits, combining electronics, photonics, signal processing and ultra-high speeds. The optical fibre has also been the backbone for enabling high speed communications, but remains a single pipe through which wavelength, time or spatial multiplexing allows enhanced functionality. Lately, multi-core fibres are allowing further integration as an overlay to the basic platform of the fibre. Unfortunately, the optical fibre is really not compatible with planar integrated circuits. This proposal address this specific problem to allow a future-proof solution to flexible optical circuit integration and interconnects in the form of an optical tape. This optical tape will be fabricated using traditional techniques for optical fibre manufacturing, allowing a cost-effective solution to the problem of fabrication. The optical tape will allow the integration of functionalised devices written with the help of lasers and be directly compatible with optical fibres and planar integrated optical platforms.