Feasibility study for the integration of a microfluidic cooling system and heat spreading on a microelectronics chip

微电子芯片的晶体管封装增加了热密度，并产生了可能改变芯片的热点。空气冷却系统由于其有限的冷却能力而不足以支持这一趋势。几十年来，以液体为冷却剂的冷却方案得到了广泛的研究。这些解决方案证明了使用液体从微电子芯片中提取热量的明显优势，特别是当集成在微电子模块中时。芯片和 ** 冷却剂之间的直接冷却避免了对热界面的依赖，热界面降低了更经典的解决方案（如 ** 冷却板）的效率。然而，这种解决方案很少或根本不适用于商业芯片。它的技术发展仍然遇到几个障碍，如：非常规专业知识的整合（泵送系统，管道和液体与包装的整合等），缺乏标准和可靠性问题。为了 ** 集成流体回路，在包装方法的调整方面也存在重大挑战。**本项目的目的是评估为具有商业价值的产品集成液体冷却和散热系统的相关性和可行性。将对各种冷却方案进行分析和数值评估 **，以量化热阻的增益，以及是否足以将 ** 转换为集成液体冷却。还将制定一些整合策略，以保证其 ** 在工业背景下的实施是可能的。因此，与Kontron Canada Inc.将允许 ** 定义冷却需求，并评估所提出的解决方案的技术可接受性。

The transistor miniaturisation for microelectronic chips increases the heat density and generates hot spots that**can alter the chips. Air-cooling systems are becoming insufficient to support this trend, due to their limited**cooling capabilities. Since a few decades, cooling solution involving liquids as coolant has been widely**studied. Those solutions demonstrated a clear advantage to use a liquid to extract heat from the microelectronic**chips, especially when integrated within the microelectronics module. Direct cooling between the chip and the**coolant avoids relying on thermal interfaces, which reduces the efficiency of more classic solutions such as**cooling plates. However, this solution is little or not applied to commercial chips. Its technological**development still meets several obstacles, such as: the integration of non-convectional expertise (pumping**systems, channeling and liquid integration with the packaging, etc.), the absence of standards, and reliability**concerns. Significant challenges are also present in the adaptation of the packaging methods in order to**integrate a fluidic loop.**The objective of this project is to evaluate the relevance and the feasibility of integrating a liquid cooling and**heat spreading system for a product of commercial interest. Various cooling scenarios will be evaluated**analytically and numerically in order to quantify the gain on the thermal resistance, and if it is sufficient to shift**to integrated liquid cooling. Some integration strategies will also be developed to guarantee that its**implementation is possible in an industrial context. So, this partnership with Kontron Canada Inc. will allow to**define the cooling need, and to evaluate the technological acceptability of the proposed solutions.